How to Choose an Atmospheric Pressure Plasma Device That You Can't Ask About Now *Explanatory Materials Provided
Precise Series
Introducing the basics of plasma devices, including "treatment forms" of atmospheric pressure plasma devices and "unique features of our equipment"! Technical materials available.
Here, we focus on explaining an atmospheric pressure plasma device that generates pure bulk plasma, rather than devices using corona treatment or arcs. By using a special electrode structure and applying high-frequency power to the electrodes based on nitrogen gas and noble gases, high-density plasma is generated. The high-density reactive species produced impart functional groups, hydroxyl groups, and amine groups to the work surface, enabling treatments such as wettability enhancement, coating performance improvement, and organic material removal. By changing the added gas, selectively generated molecules can be produced, allowing for treatments such as hydrophobization, reduction, thin film volume adjustments, and dry etching. Additionally, performing plasma treatment before cleaning processes or plating treatments activates the treated surface, enhancing reactivity with chemical solutions, improving cleaning performance, and aiding in the removal of bubbles. Considering the nature of the work and the conditions for the next process, I hope this summary serves as a reference for optimizing the selection of atmospheric pressure plasma devices. Furthermore, regarding adhesive-free bonding without the use of adhesives, I believe that bonding technology based on molecular bonding with copper foil can reduce transmission loss and contribute to the manufacturing of FCCL for 5G and 6G applications.
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basic information
【Unique Features of Our Equipment (Downstream Type)】 ■ Uniform processing for wide and long materials (100 mm to 3000 mm) ■ Processing on semiconductor chips is also possible (no change in transistor characteristics after processing) ■ No occurrence of insulation breakdown even at 4 nm L&S ■ No impact or damage from changes in intermolecular crosslinking properties or molecular cleavage within the workpiece ■ No particle generation (during sampling at 0.3 μm and 2.83 SLM) ■ Low nitrogen consumption (45% reduction compared to conventional methods) ■ Almost zero charging on the workpiece after processing 【Our Atmospheric Pressure Plasma Equipment】 ■ Downstream Type: Precise Series ■ Planar Type: Precise P Series ■ Spot Type: Precise S Series *For more details, please refer to the PDF document or feel free to contact us.
Price information
The device price varies depending on the processing width (plasma width), so please specify the size. Manufacturing of tabletop experimental devices Sample work in progress
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
We are expanding a new approach using dry processes to leverage the reliability of our equipment and various know-how cultivated through sales performance, applying its advantages to other markets (such as the battery market and particles) alongside process applications. Our downstream-type high-density plasma source (electrode) processing section is isolated from the workpiece, preventing any electrical or physical damage to the workpiece, and eliminating the effects of ultraviolet light generated during plasma creation. This allows for the only clean processing (particle-free) possible with atmospheric pressure plasma equipment. By changing the added gases, we can selectively impart molecular functionality, enabling interface control according to various surface materials as a processing technology. This is an effective means for direct adhesion, adhesion of dissimilar materials, and enhancing the adhesion of stronger coatings. The processing width (plasma width) can uniformly handle from 100mm to 3000mm. We can also accommodate carbon fiber bundles and fiber bundle shapes, allowing for uniform processing even within the bundles. Additionally, we can handle the same processing for particles. We manufacture tabletop experimental devices of the downstream type, conduct spot-type device experiments (starting from 2.5 million yen), and also carry out on-site experimental sample work.