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  6. [Design and Production Example] Coil_FPC for Motor Field Windings

[Design and Production Example] Coil_FPC for Motor Field Windings

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last updated:Sep 14, 2022

ステイ電子機器 本社
ステイ電子機器 本社

A circuit is formed considering the thickness of the flexible printed circuit (adjusting the L/S pitch). For the motor's field winding (for generating a high electromagnetic field) flexible printed circuit. *Source: Gunma University

We would like to introduce a case study of the design and production of field winding using flexible substrates that we conducted. To wind around the main pole piece, a circuit was formed considering the thickness of the flexible substrate so that the coil wiring overlaps at the same position (L/S pitch was corrected and adjusted). Due to the long structure, we implemented correction processing considering the shrinkage characteristics of the flexible material and the etching factor of the conductor, utilizing ultra-thin copper foil material. 【Case Overview】 ■L/S=100μ/100μ ■Specifications: Double-sided structure ■Base PI thickness: 25μ (no adhesive material) ■Cu thickness: 2μ (excluding Cu plating thickness) *For more details, please refer to the PDF document or feel free to contact us.

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[Design and Production Example] Coil_FPC for Motor Field Windings

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[Case Study] Introduction of Coil_FPC for Motor Field Winding

[Case Study] Introduction of Coil_FPC for Motor Field Winding

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ステイ電子機器

ステイ電子機器 本社

Electronic Components and Semiconductors

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Stay Electronics Co., Ltd. was established in 1971 in Kawasaki City as a technical group focused on the design of printed circuit boards. Since then, backed by the rapid development of the electronics industry, we have built a consistent system from development to production and sales tailored to our customers' needs, and thanks to this, we have reached our 50th anniversary. Although Japan's electronics industry is entering a mature phase, technological advancements continue to accelerate without decline. To respond to even more advanced needs, we have adopted a system focused on the mass production of flexible printed circuits (FPC) starting from prototypes, aiming for technological concentration and flexible responses. President and CEO Masahide Shida

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