Exploring the truth! If the communication worsens, it might be worth considering a malfunction in the connector terminal.
Here is a case study on cross-sectional observation of connector plating. We observed the cross-section to see how the plating condition of the connector terminals has changed due to use. This time, we prepared cross-sectional samples from two locations with different degrees of striation, one with no striation and the other with striation, to confirm the plating condition. As a result, it was found that compared to the area with no striation, Striation A and Striation B exhibited uneven plating thickness. This is believed to be due to the plating being dragged during the insertion and removal of the connector, causing variations in thickness. [Overview of Connector Plating Cross-Section] - The cross-section was prepared using a triple ion milling polisher (commonly known as CP). - The plating condition of the striated areas was observed using SEM. - Results: - No striation: Surface Au plating thickness is uniform (approximately 350 nm) - Striation A: Surface Au plating thickness is uneven (approximately 490 nm / approximately 350 nm) - Striation B: Surface Au plating thickness is uneven (approximately 130 nm / approximately 650 nm) *For more details, please refer to the PDF document or feel free to contact us.
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![[Data] Cross-section Production Method](https://image.mono.ipros.com/public/catalog/image/550895/IPROS15687227894615439038.jpeg?w=120&h=170)
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.
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