Cross-sectional observation by SEM: Connector plating

Exploring the truth! If the communication worsens, it might be worth considering a malfunction in the connector terminal.

Here is a case study on cross-sectional observation of connector plating. We observed the cross-section to see how the plating condition of the connector terminals has changed due to use. This time, we prepared cross-sectional samples from two locations with different degrees of striation, one with no striation and the other with striation, to confirm the plating condition. As a result, it was found that compared to the area with no striation, Striation A and Striation B exhibited uneven plating thickness. This is believed to be due to the plating being dragged during the insertion and removal of the connector, causing variations in thickness. [Overview of Connector Plating Cross-Section] - The cross-section was prepared using a triple ion milling polisher (commonly known as CP). - The plating condition of the striated areas was observed using SEM. - Results: - No striation: Surface Au plating thickness is uniform (approximately 350 nm) - Striation A: Surface Au plating thickness is uneven (approximately 490 nm / approximately 350 nm) - Striation B: Surface Au plating thickness is uneven (approximately 130 nm / approximately 650 nm) *For more details, please refer to the PDF document or feel free to contact us.

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