Consistent support from assembly to imaging inspection at domestic factories! Proven results in various fields such as smartphones, wearables, automotive, and medical.
We provide contract manufacturing for camera module assembly and inspection, as well as packaging for image sensor chips. From development prototypes to mass production, we propose, evaluate, and analyze optimized processes tailored to each step, and build inspection environments to bring our customers' ideas to life. 【Features】 ■ Comprehensive support from assembly to imaging inspection at our domestic factory ■ Active alignment support ■ Various reliability tests conducted ■ Imaging inspection environments (sockets, charts, etc.) and inspection equipment are also manufactured in-house *For more details, please contact us or download the PDF to view.
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basic information
■12-inch wafer processing (backside polishing, dicing) support ■Individual piece substrate support (ceramic, rigid-flex, flex) ■SMT in a clean room environment ■Flux cleaning support ■Image sensor cleaning support ■Mounting of IR cut filters, lid glass, and lens holders (UV resin / epoxy resin) ■Localized heating soldering with lasers ■ACF connection between core modules and flex
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Applications/Examples of results
■Smartphones, wearables, in-vehicle devices, medical devices
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Estakaya Electronics Co., Ltd. has contributed to the development of an information-oriented society through the development and manufacturing of LSI (Large Scale Integration) devices and modules. Currently, we are also engaged in the manufacturing and sales of unique development products utilizing our long-cultivated technology and know-how, as well as the sale and service of environmental products to the local community. In the future, we will further respond to the diverse needs of our customers in an evolving society, from the development of original LSI device and module products to the establishment of production systems, as well as the creation of custom-made equipment and tools.