From manual sensory appearance inspection by humans to fully automated inspection by equipment! Introducing complete traceability.
Our company provides semiconductor package services, including wafer processing and 2D + 3D automatic inspection for bump bonding wafers. We are capable of conducting 100% inspection by combining 2D (chip surface condition/dicing condition inspection) and 3D (bump bonding measurement) technologies. We offer a consistent response from wafer acceptance inspection to post-inspection, implementing complete traceability. 【Features】 ■ Consistent manufacturing and inspection line ■ Complete traceability ■ Ability to differentiate between wafer-related and process-related issues ■ Prevention of defective products flowing into subsequent processes *For more details, please feel free to contact us.
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basic information
【Inspection Specifications】 ■ Appearance inspection of wafers ■ High-speed, high-precision 2D/3D measurement of bumps ■ Output of detection and measurement results as map data ■ In-house cleanliness class 10 ■ Barcode verification *For more details, please feel free to contact us.
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Company information
Estakaya Electronics Co., Ltd. has contributed to the development of an information-oriented society through the development and manufacturing of LSI (Large Scale Integration) devices and modules. Currently, we are also engaged in the manufacturing and sales of unique development products utilizing our long-cultivated technology and know-how, as well as the sale and service of environmental products to the local community. In the future, we will further respond to the diverse needs of our customers in an evolving society, from the development of original LSI device and module products to the establishment of production systems, as well as the creation of custom-made equipment and tools.
