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We will introduce how the University of South-Eastern Norway is utilizing assembly equipment from Finetech to promote innovation at one of Norway's leading microtechnology hubs. The University of South-Eastern Norway (USN), which has 20,000 students across eight campuses, is one of the educational institutions in Norway. This university, which was formed by the merger of three regional colleges, currently offers a variety of bachelor's, master's, and doctoral programs in many scientific fields. In addition, USN not only plays an important role in domestic and international research and education but is also closely linked to one of the dynamic economic regions. This case study introduces the use of high-precision die bonders in the "Electronic Coast." *For more detailed information about the case study, please refer to the PDF document. Feel free to contact us for more details.
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*You can view the detailed information of the case from the PDF document. For more information, please feel free to contact us.*
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*You can view the detailed information about the case in the PDF document. For more information, please feel free to contact us.*
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Company information
Fine Tech is a manufacturer of die bonders and flip chip bonders, headquartered in Berlin, Germany, specializing in the development, design, and manufacturing of high-precision die bonding equipment, consistently providing cutting-edge assembly technology. We strive to support all our customers, ranging from venture companies to multinational corporations, universities, and government agencies, across various fields including electronics, electronic devices, optical components, aerospace, medical, and military. Fine Tech Japan Co., Ltd. was established on August 1, 2014, as a base for sales and application support related to die bonding for Japanese customers, and we are actively working to provide the latest assembly technology to our customers in Japan.