Thoroughly manage the situation and take action based on the guidelines to "raise" it.
Texas Corporation inherits the die bonding technology of Nidec Tosok Corporation and practices the automation of semiconductor manufacturing equipment based on that technology. We implement a safety-first management philosophy, thoroughly manage pre-conditions, and act in accordance with our guiding principles. 【Product Information】 ○DBD4200R / EBD4200R ○DBD4600S / EBD4600 ○DBD3580SW ○EBD4350S For more details, please contact us or download the catalog.
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basic information
【Basic Management Policy】 [Customer's "Safety First"] ○ Do not inconvenience customers in their "manufacturing" ○ Keep delivery dates (promises) ○ Practice CSR [Employee's "Safety First"] ○ Protect management and realize employees' dreams ○ Image of employees who adhere to compliance [Quality's "Safety First"] ○ The will to meet delivery dates creates quality ○ Seek evidence and pursue functionality ● For more details, please contact us or download the catalog.
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Price range
P7
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Line up(5)
Model number | overview |
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DBD4200VR | Die bonder for eutectic process, high-speed for tape L/F. Dispensing option available. |
EBD4200VR | Die bonder for epoxy, high-speed for tape L/F. |
DBD4600VS | Die bonder for eutectic, high-speed for strip L/F. Dispensing option available. |
EBD4600VS | Die bonder for epoxy, high-speed for strip L/F. |
DBD3580SW | Die bonder for wire solder process. |
catalog(1)
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We inherit the die bonding technology of Nidec Tosok Corporation and are implementing automation of semiconductor manufacturing equipment based on that technology. We are actively developing new projects and aim to contribute to the business of our partner companies through original product development. While further refining the technology established since our founding, we pursue the creation of products that combine high convenience and reliability, and we will continue to grow towards a valuable future.