Bonding position accuracy of 0.5µm!
In the latest applications of optical devices, high data transfer speeds, composite transmitters, receivers, and mixed elements are important components. In the implementation process of these components, precise position control through appropriate bonding techniques is required.
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basic information
**Fine Tech Corporation's Solutions** - **0.5µm Bonding Position Accuracy** Active alignment is typically used for optical component mounting applications; however, Fine Tech's die bonders can easily perform high-precision alignment and positioning control for optical components, allowing for the mounting of VCSEL arrays and PD arrays while maintaining perfect balance. - **Unique Pickup Tool Provided** Fine Tech offers a proprietary pickup tool that enables the mounting of VCSELs, PD arrays, and other components on substrates in a face-up position while ensuring sub-micron positional accuracy. This greatly contributes to improved position accuracy and reduced tact time. - **Expanded Field of View + High Magnification Alignment** Small components need to be recognized at high magnification. As a result, the field of view becomes smaller, limiting the freedom of pattern recognition. Fine Tech's die bonder can capture all areas of large components and substrates at high resolution through its optical shift function. It is capable of accurately mounting VCSELs and PD arrays that are 200µm x 3000µm or larger.
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○FINEPLACER Series High-Precision Die Bonding Equipment The FINEPLACER series high-precision die bonding equipment flexibly accommodates various mounting applications through the adoption of a modular system.
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Company information
Fine Tech is a manufacturer of die bonders and flip chip bonders, headquartered in Berlin, Germany, specializing in the development, design, and manufacturing of high-precision die bonding equipment, consistently providing cutting-edge assembly technology. We strive to support all our customers, ranging from venture companies to multinational corporations, universities, and government agencies, across various fields including electronics, electronic devices, optical components, aerospace, medical, and military. Fine Tech Japan Co., Ltd. was established on August 1, 2014, as a base for sales and application support related to die bonding for Japanese customers, and we are actively working to provide the latest assembly technology to our customers in Japan.