Supporting the ever-evolving semiconductor applications!
We handle the die attach systems from Besi. To meet the ever-evolving semiconductor applications, we continue to evolve with advanced technology. Please feel free to contact us if you have any requests. 【Four Categories】 ■ Multi-Module Bonder ■ Epoxy Die Bonder ■ Soft Solder Die Bonder ■ Flip Chip Bonder *For more details, please download the PDF or contact us.
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basic information
【Product Lineup】 ■ Multi-Module Attach ・Datacon 2200Evo plus ・Datacon 2200Evo hs ・Datacon 2200Evo advanced ■ Die Bonding ・Esec 2100hs, hsi ・Esec 2100 sDplus, sD advanced ・Esec 2100 sDPPPplus ■ Soft Solder Die Bonding ・Esec 2100DS ・Esec 2009SSIE ・Esec 2009fSE ■ Flip Chip ・Datacon 8800TC advanced ・Datacon 8800FC Quantam advanced ・Datacon 8800FC Quantam sigma ・Datacon 8800 CHAMEO advanced ・Esec 2100FC hs *For more details, please download the PDF or contact us.
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Applications/Examples of results
**Application Achievements** ■ Multi-Module Attachment - Camera module bonding, LED module bonding, HDD module bonding, ultra-shaped module bonding, etc. ■ Die Bonding - Ag paste lead frame-based die bonding ■ Soft Solder Die Bonding - Soft solder lead frame-based die bonding (SOP/QFP/QFN, etc.) ■ Flip Chip - Flip chip bonding, wafer-to-wafer (WtoW) bonding, chip-to-wafer (CtoW) bonding, large panel die bonding, etc. *For more details, please download the PDF or contact us.*
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Company information
Our company is the exclusive agent in Japan for Besi (BE Semiconductor Industries N.V.) and cyberTECHNOLOGIES (cyberTECHNOLOGIES GmbH). We provide various manufacturing equipment for semiconductor backend processes and high-resolution three-dimensional shape measurement systems. Please feel free to contact us if you have any inquiries.