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  3. Measurement and Analysis
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  5. Analytical Equipment and Devices
  6. FE-SEM observation (Crystal grain observation of Al wire bonding section)

FE-SEM observation (Crystal grain observation of Al wire bonding section)

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last updated:Jun 26, 2025

アイテス
アイテス
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High-brightness electron gun for detailed SEM images! Equipped with an in-lens SE detector sensitive to surface information.

The ZEISS "FE-SEM ULTRA55" is equipped with a GEMINI column, allowing for high-resolution observation at extremely low acceleration voltages. It also features multiple detectors, enabling the observation of various samples. Composition information can be obtained using two types of backscattered electron detectors, and high-resolution EDX analysis can be performed even at low acceleration voltages. 【Features】 ■ High-brightness electron gun for detailed SEM images ■ Ultra-surface analysis at extremely low acceleration voltages ■ In-lens SE detector sensitive to surface information ■ Composition information obtained from two types of backscattered electron detectors ■ High-resolution EDX analysis even at low acceleration voltages ■ Observation without deposition *For more details, please refer to the PDF document or feel free to contact us.

    Analytical Equipment and DevicesOther contract services
2021-07-02_14h57_46.png

FE-SEM observation (Crystal grain observation of Al wire bonding section)

2021-07-02_14h57_46.png
2021-07-02_14h57_46.png 2021-07-02_14h57_55.png 2021-07-02_14h58_07.png 2021-07-02_14h58_14.png 2021-07-02_14h58_22.png 2021-07-02_14h58_32.png
  • Related Link - https://www.ites.co.jp/analyze/apparatus/fe-sem
  • Special site - Product/service details - https://pr.mono.ipros.com/ites/product/

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[Applicable Targets] ■ IC packages, mounting and joining components, mounting substrates, LSI devices, LCD thin films, metal surface conditions, observation and analysis of crystal grains, etc. *For more details, please refer to the PDF document or feel free to contact us.*

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Cross-sectional observation by SEM: Connector plating

Cross-sectional observation by SEM: Connector plating

TECHNICAL
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Differences in appearance due to SEM observation conditions.

Differences in appearance due to SEM observation conditions.

TECHNICAL
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Detection sensitivity due to differences in acceleration voltage during SEM-EDX analysis.

Detection sensitivity due to differences in acceleration voltage during SEM-EDX analysis.

TECHNICAL
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Total support service for cross-section grinding, processing, observation, and analysis.

Total support service for cross-section grinding, processing, observation, and analysis.

OTHER
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Analysis of Li-ion battery separators

Analysis of Li-ion battery separators

TECHNICAL
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Observation of fracture surfaces using SEM: crab clasp

Observation of fracture surfaces using SEM: crab clasp

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[Analysis Example by EBSD] Chip

[Analysis Example by EBSD] Chip

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FE-SEM observation (Crystal grain observation of Al wire bonding section)

FE-SEM observation (Crystal grain observation of Al wire bonding section)

TECHNICAL
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Observation of wire bonding shapes

Observation of wire bonding shapes

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Examples of cross-sectional observation of wire bonding with various compositions.

Examples of cross-sectional observation of wire bonding with various compositions.

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アイテス

アイテス

Electronic Components and Semiconductors

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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