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  6. Continuous electroplating with uniform and high adhesion is possible on φ0.005mm ultra-fine wire.

Continuous electroplating with uniform and high adhesion is possible on φ0.005mm ultra-fine wire.

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last updated:Dec 26, 2022

トクサイ 本社
トクサイ 本社
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Continuous electroplating of ultra-fine wire with a unique technology from Tokusai, achieved through thin and long processes.

At Tokusai, we can continuously electroplate ultra-fine metal wires with a minimum diameter of φ0.005mm (φ5μm) using metals such as gold, silver, copper, nickel, tin-copper, and palladium. Additionally, it is possible to apply multiple platings (such as gold, nickel, and copper) on a single wire. For example, it is possible to first apply a nickel plating as a base and then apply a gold plating on top. 【Features of Tokusai's Electroplating】 (1) No color unevenness, with uniform plating thickness (±0.2μm) (2) Excellent adhesion (3) Surface roughness can be reduced through post-plating drawing 【Expected Effects of Plating Processing】 (1) Improved solder wetting properties… copper plating, tin-copper plating, nickel plating, etc. (2) Enhanced corrosion resistance… gold plating, palladium plating, etc. (3) Control of resistance values… silver plating, copper plating, etc. (4) Improved wear resistance… nickel plating, etc. (5) Enhanced aesthetic appearance… gold plating, etc. *For more details, please refer to the PDF document or feel free to contact us.

    Processing Contract
Plating_300x300px.jpg

Continuous electroplating with uniform and high adhesion is possible on φ0.005mm ultra-fine wire.

Plating_300x300px.jpg
Plating_300x300px.jpg
  • Related Link - http://www.tokusai.co.jp/%E3%82%81%E3%81%A3%E3%81%…

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basic information

【Platable Wires】 Tungsten, molybdenum, copper alloys, piano wire, stainless steel, nickel-titanium, etc. 【Available Plating Types】 Gold, silver, copper, nickel, palladium, tin bronze, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Applications/Examples of results

【Examples of Use】 (1) Electrical and electronic device components such as smartphones, game consoles, and small cameras (2) Office equipment components such as PPC copiers and multifunction devices (3) Semiconductor testing equipment (4) Medical devices (5) Accessories and decorative items *For more details, please refer to the PDF document or feel free to contact us.

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Technical Data: Wire Drawing and Plating Process

Technical Data: Wire Drawing and Plating Process

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トクサイ

トクサイ 本社

Electronic Components and Semiconductors

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Tokushai Co., Ltd. manufactures and sells various metal and alloy wire drawing processes and drawn products (such as cut pins, rods, straightening processes, and flat wire produced by rolling), starting with difficult-to-process materials like tungsten and molybdenum, as well as stainless steel, nickel-titanium alloys, and beryllium copper alloys. Additionally, thanks to our unique plating production line, we can also produce continuously long plated wires. With 70 years of experience in wire drawing (drawing and pulling) technology and the craftsmanship of skilled artisans who create wires so thin they are nearly invisible, we realize a world of ultra-fine wires. Starting with tungsten wire for Christmas light filaments as our founding product, Tokushai has expanded its business alongside the development of the lighting market, including incandescent bulbs, fluorescent lamps, and automotive bulbs. Today, we have broadened our market to include semiconductor testing equipment (probe cards), electronic components, medical devices, and even the aerospace industry, responding to various customer needs.

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