Packaging with a special technique! Achieving high functionality!
●Partial Exposure Mold This is a package that partially opens the mold resin to expose the surface of the semiconductor. The exposed shape can be customized according to the application of the component.
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basic information
【Basic Flow】 - Wafer acceptance - Wafer backside grinding (back grind) - Dicing (D/C, D/S) - Die bonding (die attach), flip chip - Wire bonding - Molding - Marking - Package dicing (singulation) - Testing - Visual inspection - Packaging, shipping
Price range
Delivery Time
Applications/Examples of results
【Applicable Examples】 - Optical sensors, encoder light receiving parts - Various types of sensors
Company information
Estakaya Electronics Co., Ltd. has contributed to the development of an information-oriented society through the development and manufacturing of LSI (Large Scale Integration) devices and modules. Currently, we are also engaged in the manufacturing and sales of unique development products utilizing our long-cultivated technology and know-how, as well as the sale and service of environmental products to the local community. In the future, we will further respond to the diverse needs of our customers in an evolving society, from the development of original LSI device and module products to the establishment of production systems, as well as the creation of custom-made equipment and tools.
![Special Molded Forming [Transparent Resin Mold]](https://image.mono.ipros.com/public/product/image/02c/2000631950/IPROS64314279581953840401.png?w=280&h=280)
![Special Molded Forming [Pre-Molded Hollow Package]](https://image.mono.ipros.com/public/product/image/db0/2000631952/IPROS01062826307215082287.png?w=280&h=280)
