The digitization of cars is rapidly advancing with "CASE" as the keyword.
The electronicization of vehicles is rapidly advancing with "CASE" as the keyword. The powertrain is shifting from engines to inverters/motors/batteries, driving is being taken over by drive computers, and wireless communication is being replaced by 5G. All of these involve significant heat generation, making the cooling of electrical and electronic devices crucial for reliability. To address these thermal issues, it is important to understand the behavior of heat and implement appropriate cooling structures. Here, we will provide a detailed explanation from the basics for beginners to the latest thermal countermeasures.
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basic information
Date and Time: September 10, 2021 (Friday) 10:30 AM - 4:30 PM [WEB Exclusive Seminar] *You can attend the seminar from home or while at work. [Program] 1. "CASE" and Heat - Thermal Issues in Automotive Electronics 1-1. Operating Environment and Heat Generation Areas of Automotive Devices 1-2. Issues Caused by Heat Thermal Stress, Degradation, Performance Decline, Thermal Runaway, etc. 2. Basic Knowledge for Thermal Design of Automotive Devices 2-1. Mechanisms of Heat Transfer 2-2. Reducing Thermal Conductivity and Contact Thermal Resistance 2-3. Mechanisms and Calculations of Convection - Improving Efficiency of Water Cooling and Air Cooling 2-4. Mechanisms and Applications of Thermal Radiation - Strategies for Increasing Emissivity 2-5. Approaches to Design Based on Thermal Resistance 3. Structure and Heat Dissipation Path of Inverters 3-1. Heat Dissipation Path and Bottlenecks of Inverters 3-2. Measures for Reducing Thermal Resistance 3-3. Structure and Effects of Direct Cooling 3-4. Dual-Sided Cooling 4. Heat Dissipation Structure of ECUs 4-1. Main Heat Sources 4-2. Cooling Methods - Natural Air Cooling, Forced Air Cooling, Water Cooling 4-3. Measures for Reducing Contact Thermal Resistance For the continuation of the program, please refer to the "Applications/Examples of Achievements" below.
Price information
51,000 yen (including tax) *Includes materials *For those who do not wish to receive email notifications, the tuition fee is "51,000 yen × number of participants" *For those who wish to receive email notifications (free of charge): ★If applying as 1 person, 45,900 yen ★If applying for 2 people at the same time, the fee is 51,000 yen for 2 people (the second person is free) ★If applying for 3 people at the same time, the fee is 73,000 yen for 3 people ★If applying for 4 or more people at the same time, the fee is the tuition for 3 people + 20,000 yen for each additional person beyond 3 *Applications for 2 or more people at the same time are limited to the same organization. *For participation of 2 or more people, a separate application is required for each participant.
Price range
P2
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Applications/Examples of results
【Program】 5. Heat Dissipation Materials Used in Automotive Equipment 5-1 Types and Applications of TIM 5-2 Heat Dissipation Sheets 5-3 Gap Fillers 5-4 Thermal Grease 5-5 Use Cases 6. Structure of Batteries and Thermal Countermeasures 6-1 Thermal Characteristics of Batteries (Thermally Sensitive LiB) 6-2 Heat Dissipation Pathways and Bottlenecks 6-3 Challenges and Solutions of Water Cooling Systems 7. Cooling of Computers for Autonomous Driving 7-1 Water Cooling in TESLA M3 7-2 Cooling of High Heat-Generating Logic Devices like SoC 7-3 Cooling of Wireless Communication Modules and LiDAR 8. EV Motors and Their Thermal Countermeasures 【Target Audience】 This course is aimed at those who will be involved in thermal-related work and those who are struggling with thermal issues, providing explanations from the basics. - Individuals involved in thermal design, implementation design, and circuit design of automotive equipment - Individuals involved in the development of heat dissipation materials and thermal countermeasures - Individuals involved in reliability evaluation, etc.
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Download All Catalogs![[Web Seminar] Thermal Resistance Reduction and Thermal Measures through Structure in xEV Component Devices](https://image.mono.ipros.com/public/catalog/image/01/2b5/601155/IPROS95427002478151363138.jpeg?w=120&h=170)
Company information
S&T Publishing publishes technical books aimed at researchers and engineers.
