[Web Seminar] Reducing Thermal Resistance in xEV Components

basic information

Date and Time: September 10, 2021 (Friday) 10:30 AM - 4:30 PM [WEB Exclusive Seminar] *You can attend the seminar from home or while at work. [Program] 1. "CASE" and Heat - Thermal Issues in Automotive Electronics 1-1. Operating Environment and Heat Generation Areas of Automotive Devices 1-2. Issues Caused by Heat Thermal Stress, Degradation, Performance Decline, Thermal Runaway, etc. 2. Basic Knowledge for Thermal Design of Automotive Devices 2-1. Mechanisms of Heat Transfer 2-2. Reducing Thermal Conductivity and Contact Thermal Resistance 2-3. Mechanisms and Calculations of Convection - Improving Efficiency of Water Cooling and Air Cooling 2-4. Mechanisms and Applications of Thermal Radiation - Strategies for Increasing Emissivity 2-5. Approaches to Design Based on Thermal Resistance 3. Structure and Heat Dissipation Path of Inverters 3-1. Heat Dissipation Path and Bottlenecks of Inverters 3-2. Measures for Reducing Thermal Resistance 3-3. Structure and Effects of Direct Cooling 3-4. Dual-Sided Cooling 4. Heat Dissipation Structure of ECUs 4-1. Main Heat Sources 4-2. Cooling Methods - Natural Air Cooling, Forced Air Cooling, Water Cooling 4-3. Measures for Reducing Contact Thermal Resistance For the continuation of the program, please refer to the "Applications/Examples of Achievements" below.

Price information

51,000 yen (including tax) *Includes materials *For those who do not wish to receive email notifications, the tuition fee is "51,000 yen × number of participants" *For those who wish to receive email notifications (free of charge): 　★If applying as 1 person, 45,900 yen 　★If applying for 2 people at the same time, the fee is 51,000 yen for 2 people (the second person is free) 　★If applying for 3 people at the same time, the fee is 73,000 yen for 3 people 　★If applying for 4 or more people at the same time, the fee is the tuition for 3 people + 20,000 yen for each additional person beyond 3 *Applications for 2 or more people at the same time are limited to the same organization. *For participation of 2 or more people, a separate application is required for each participant.

Price range

P2

Delivery Time

Applications/Examples of results

【Program】 5. Heat Dissipation Materials Used in Automotive Equipment 5-1 Types and Applications of TIM 5-2 Heat Dissipation Sheets 5-3 Gap Fillers 5-4 Thermal Grease 5-5 Use Cases 6. Structure of Batteries and Thermal Countermeasures 6-1 Thermal Characteristics of Batteries (Thermally Sensitive LiB) 6-2 Heat Dissipation Pathways and Bottlenecks 6-3 Challenges and Solutions of Water Cooling Systems 7. Cooling of Computers for Autonomous Driving 7-1 Water Cooling in TESLA M3 7-2 Cooling of High Heat-Generating Logic Devices like SoC 7-3 Cooling of Wireless Communication Modules and LiDAR 8. EV Motors and Their Thermal Countermeasures 【Target Audience】 This course is aimed at those who will be involved in thermal-related work and those who are struggling with thermal issues, providing explanations from the basics. - Individuals involved in thermal design, implementation design, and circuit design of automotive equipment - Individuals involved in the development of heat dissipation materials and thermal countermeasures - Individuals involved in reliability evaluation, etc.