Plating in the lithography process, basics of resist masks and troubleshooting measures - Stabilization of shape and dimensions, adhesion and peeling, bubble and defect countermeasures.
In recent years, plating technology has established its importance as a foundational technology in the electronics industry. In electronics such as semiconductor devices, high-frequency printed circuit boards, and MEMS, it is primarily utilized as a wiring formation technology. Additionally, lithography technology is necessary to form high-precision wiring and plug structures. This technology forms a plating layer limited to areas designed with a resist mask. The resist mask is also used as an etching mask. High precision of the resist mask is essential for controlling the wiring shape through plating. In this seminar, we will discuss the plating technology of wiring materials such as Cu and Ni, the basics of lithography technology, and the enhancement of resist mask precision. We will also explain troubleshooting methods for issues such as mask deformation and mask peeling. This course is designed to be easy to understand for beginners, allowing them to learn from the basics. Additionally, we will address daily troubleshooting consultations that participants may have.
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Date and Time: October 29, 2021 (Friday) 10:30 AM - 4:30 PM [WEB Exclusive Seminar] *You can attend the seminar from home or while at the office. [Program] 1. Plating Technology in Lithography 2. High Precision of Resist Masks 2.1 Basic Processes and Control 2.2 Measures for Resist Troubles 3. High Precision of Plating Technology 3.1 Basic Processes 3.2 Measures for Plating Troubles 4. Reference Materials 5. Q&A Individual consultations for daily development and trouble issues will be provided.
Price information
51,000 yen (including tax) *Includes materials *For those who do not wish to receive email notifications, the tuition fee is "51,000 yen × number of participants" *For those who wish to receive email notifications (free of charge): ★If applying as one person, 45,900 yen ★If applying for two people at the same time, the fee is 51,000 yen for two people (the second person is free) ★If applying for three people at the same time, the fee is 73,000 yen for three people ★If applying for four or more people at the same time, the fee is the tuition for three people plus 20,000 yen for each additional person beyond three *Applications for two or more people at the same time are limited to the same organization. *For two or more participants, a separate application is required for each participant.
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P2
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【Target Audience】 This is aimed at engineers involved in the plating technology field. The seminar content is at a practical level, but it will be explained in an easy-to-understand manner for beginners. 【What You Will Learn】 - Acquisition of fundamental knowledge related to lithography and plating technology - Mastery of plating and masking technology processes - Ability to respond to troubles
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S&T Publishing publishes technical books aimed at researchers and engineers.