High-precision measurement of the positional deviation of patterns on the wafer surface/backside.
The DSM8/200 Gen2 is a dual-sided positioning measurement device compatible with 2 to 8-inch wafers. It is equipped with a function to eliminate TIS (tool-induced errors), achieving high-precision measurements in dual-sided patterning substrates in fields such as MEMS, power devices, and optical devices.
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basic information
- Device Specifications Supported wafer size: 2~8 inch wafers Measurement accuracy: 0.2um (3σ) Visible light observation Non-contact pre-aligner - Options Infrared light observation Wafer transport mechanism (DSM200 Gen2)
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Applications/Examples of results
MEMS, power devices, optical devices, etc.
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Company information
Our company started in 1982 as a technical trading company specializing in the sales and maintenance services of semiconductor manufacturing equipment imported from overseas, as a group company of Kanematsu Corporation. Recently, in order to meet the diverse needs of our customers, we have been committed to ensuring that not only manufacturing equipment but also overseas products such as parts, materials, and subsystems can be used with confidence by our customers. While being a trading company, we have enhanced our technical department, which is responsible for planning, development, design, and manufacturing, to propose comprehensive technical solutions and expand our business globally to customers both domestically and internationally. In the future, we aim to continue being a company that provides new added value and services as an electronics technology trading company, growing together with our customers.
