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  6. Optical Component: Glass LID (AuSn Bonding Type)

Optical Component: Glass LID (AuSn Bonding Type)

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last updated:Oct 15, 2021

山村フォトニクス
山村フォトニクス
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We propose custom designs, including optical coatings, tailored to your applications and requirements!

The "Glass LID" is a component that joins various optical windows with a metal frame, used as a cover in packages such as LEDs, lasers, and MEMS. The AuSn type LID was primarily developed for UV-LED packages. We propose a design that uses our original composition of ultraviolet-transmitting glass as the window material and directly joins the metal frame without using low-melting-point sealing glass. 【Features】 ■ Direct sealing method that does not use low-melting-point sealing glass ■ Fewer components allow for miniaturization and low-profile design ■ No concerns about the flow of sealing glass, enabling a wide aperture ■ Customizable ■ Other solder materials besides AuSn can also be considered *For more details, please refer to the PDF document or feel free to contact us.

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2021-10-13_11h33_22.png

Optical Component: Glass LID (AuSn Bonding Type)

2021-10-13_11h33_22.png
2021-10-13_11h33_22.png
  • Related Link - https://www.yama-ph.co.jp/product/glass-lid-for-au…

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山村フォトニクス

山村フォトニクス

Electronic Components and Semiconductors

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Since its founding in 1949, we have developed our business based on the glass material technology and glass-to-metal sealing technology (GTMS) cultivated through glass products for vacuum tubes. Building on this accumulated technology, we have also aligned our innovations from vacuum tubes to semiconductors, and as a result of continuously providing various components that respond to the integration of light and electronics, our technology has now borne fruit in three business areas: "glass components for electrical and electronic devices," "optoelectronics packaging components," and "glass ceramics (LTCC)."

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