UV-LED light source! Automatic exposure device for semiconductor manufacturing | Mask aligner
AMA6000
This is an exposure device that has replaced the light source from a mercury lamp to an LED. It features automatic parallel adjustment, complete non-contact gap management, and auto-alignment functions.
This product is an automatic batch equal magnification exposure device (mask aligner) equipped with a UV-LED light source. One of our features is that it allows for fully non-contact automatic parallel adjustment of the stage and mask for the photomask and wafer. By incorporating a super-precision UVW drive stage and performing high-performance image processing, the alignment of the photomask and wafer is also carried out accurately. It supports exposure methods including proximity, soft, and hard contact. We offer a lineup that matches production volume, from manual machines to fully automatic machines, and since we handle everything from design to manufacturing and sales in-house, we have achieved low prices. 【Features】 ■ Compatible with i-line (365nm) and H-line (405nm)! (Please consult us for g-line) ■ Non-contact parallel alignment and exposure of photomask and wafer ■ Auto-alignment function ■ Easy setup change and compatible with multiple substrate sizes ■ Space-saving & easy maintenance ■ Achieves low cost and compact design, suitable for small-batch production of various types ■ Equipped with a super-precision UVW stage *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Main Specifications】 ■ Mask Size: □3" to □7" ■ Wafer Size: Φ2" to Φ6", Square Substrate □2" to 4" ■ Cassette Stage: 2 sets ■ Centering Unit with Automatic Alignment Function: 1 set ■ Exposure Light Source: i-line LED Light Source (equivalent to 500W) ■ Equipped with Auto-Alignment Function (by FAST Corporation) ■ Equipment Size: (example) 1200×1200×1900 (main body) ■ Transport Method: Double Arm Clean Robot (Class 1 compatible) *For more details, please refer to the PDF document or feel free to contact us.
Price information
Prices vary depending on wafer size and option specifications, so please contact us for details.
Delivery Time
※5 to 6 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.