[Case Study] Communication Device Manufacturer Company A

Successfully achieved wafer bumping with a 180μm pitch! Established a mass production line using screen printing.

The development team at Company A was conducting evaluation experiments with several printing machine manufacturers in anticipation of mass production of a new communication device for mobile terminals, focusing on solder bumping through screen printing. However, they were not achieving satisfactory results. In response, we proposed utilizing the filling pressure control feature of the press-fit squeegee unit equipped in our printing machine "TD-4420 series" with the following suggestions: - "Proposing pressurization conditions that allow 100% solder paste filling within the mask opening." - "Recommending the use of high-viscosity solder paste of approximately 280 Pa·s, which cannot be handled by conventional printing machines, as a countermeasure against solder bridging." The issues that had been troublesome during evaluation experiments with other manufacturers' printing machines were resolved quite easily, allowing them to start mass production as planned without significantly revising the new product's production process. [Proposed Product] - Solder paste printing machine "TD-4420" - Squeegee unit - Wet cleaner *For more details, please refer to the PDF document or feel free to contact us.*

Printing MachineryOther semiconductor manufacturing equipmentOther mounting machines