Successfully achieved wafer bumping with a 180μm pitch! Established a mass production line using screen printing.
The development team at Company A was conducting evaluation experiments with several printing machine manufacturers in anticipation of mass production of a new communication device for mobile terminals, focusing on solder bumping through screen printing. However, they were not achieving satisfactory results. In response, we proposed utilizing the filling pressure control feature of the press-fit squeegee unit equipped in our printing machine "TD-4420 series" with the following suggestions: - "Proposing pressurization conditions that allow 100% solder paste filling within the mask opening." - "Recommending the use of high-viscosity solder paste of approximately 280 Pa·s, which cannot be handled by conventional printing machines, as a countermeasure against solder bridging." The issues that had been troublesome during evaluation experiments with other manufacturers' printing machines were resolved quite easily, allowing them to start mass production as planned without significantly revising the new product's production process. [Proposed Product] - Solder paste printing machine "TD-4420" - Squeegee unit - Wet cleaner *For more details, please refer to the PDF document or feel free to contact us.*
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[Proposed Content] ■ Utilizing the filling pressure control function of the press-fit squeegee unit equipped in our printing machine "TD-4420 Series," we propose the following: - Propose pressure conditions that allow 100% solder paste to be filled within the mask opening. - Suggest the use of high-viscosity solder paste of approximately 280 Pa·s, which cannot be handled by conventional printers, as a countermeasure against solder bridging. ■ Propose conditions to maximize the functionality of the built-in wet mask cleaner in the printing machine, enabling long hours of continuous production without stoppage. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Our business consists of three core areas: SMT (Surface Mount Technology) related business, semiconductor related business, and product development business. Our strength lies in providing one-stop services from assembly of printed circuit boards utilizing the features of our in-house developed solder paste printing machines to unit assembly and repair services for touch panels and display products. Additionally, we are capable of producing products certified under ISO9001, ISO14001, as well as ISO13485 for medical devices and UL standards. On the other hand, in the semiconductor related business, we have solved many customer challenges with our advanced printing technology and know-how. We are developing a business model where our main SMT related business and semiconductor related business are supported by the product development business from both software and hardware perspectives.