The illumination distribution of the exposure light source is within ±5%! A lineup of desktop and standalone models is available.
The "BA100/160/200" is a manual double-sided mask aligner that achieves high positional accuracy patterning on both the top and bottom sides. In addition to the desktop models "BA100" for 4-inch wafers and "BA160" for 6-inch wafers, there is also a standalone model "BA200" for 8-inch wafers. Furthermore, the alignment accuracy is ±2μm on the top side and ±5μm on the bottom side. 【Specifications (excerpt)】 ■ Wafer size: 4in/6in/8in ■ Exposure light source intensity distribution: within ±5% ■ Exposure resolution ・Soft contact: L/S 3μm ・Hard contact: L/S 1μm *For more details, please refer to the PDF document or feel free to contact us.
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【Other Specifications】 ■Alignment Accuracy ・Top-side: ±2μm ・Bottom-side: ±5μm *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Until now, we have continuously faced challenges with the desire to propose optimal system integration to our customers while sensitively responding to the trends of the times in industries such as paper, pulp, automotive, automotive parts, semiconductors, LCDs, and smartphones. Moving forward, we will actively enter the "three industries" of "food, pharmaceuticals, and cosmetics," which are essential for people's lives, while inheriting this way of thinking. Additionally, in fields expected to grow, such as semiconductors and high-performance LCDs, we will actively engage in the development and manufacturing of precision alignment exposure equipment, inspection equipment, and process manufacturing equipment as a device manufacturer.