Design of insertion and extraction mechanisms used in various device enclosures and substrate inspection jigs.
We have a wide range of experience, from specialized designs such as medical ultrasound devices that require management of the coordinates of elements on the substrate, to electromechanical design involving considerations for the routing of the substrate, housing, and harness, as well as waterproof and airtight designs, pressure vessel designs, water cooling block designs, and basic thermal designs. We are increasingly involved in projects where we assist from the specification determination stage by understanding the customer's desired specifications, and we excel in providing flexible responses.
Inquire About This Product
basic information
【Design Tools】 ■Design CAD SOLIDWORKS Standard Solid Edge 【Design Achievements】 ■For material research and development companies Ultra-compact projector mounting device (Prototype for wearable device) ■For marine industry companies Commercial AC power voltage conversion box (Additional processing of Takachi case) Camera and lens diameter conversion adapter (Cutting processing) ■For aerospace companies Mass measurement circuit box (Additional processing of Takachi case) ■For manufacturers 19-inch rack-mounted device enclosure 19-inch rack shelf (Sheet metal processing) ■For medical industry companies Computer expansion slot fixing hardware (Sheet metal processing) Board inspection insertion and extraction assist device (Sheet metal, painting, mechanical design)
Price range
Delivery Time
Applications/Examples of results
-
catalog（1）
Download All Catalogs
Company information
Kai Electronics Co., Ltd. is a group of design engineers. Within the company, there are three types of engineers specializing in system design, enclosure design, and printed circuit board design, allowing for designs that consider requirements from other processes and pursue optimal solutions from multiple perspectives. For example, we can examine ESD countermeasures from both electrical and mechanical aspects, confirm the interference between printed circuit boards and enclosures, select components based on interference information, and consider board size and layer count, making it easier to aggregate and review information from various design technologies. We are committed to gathering information beyond the boundaries of each of the three design technologies to meet the required specifications and achieve shorter delivery times. Our company is involved in the design of a wide variety of products without specialization in specific applications, handling over 200 new development projects annually for about 30 companies. With the expertise of our design engineers cultivated through these experiences and the coordination skills of our sales representatives, we fully support new product development.
![[Development Case] Enclosure Design Embedded Systems](https://image.mono.ipros.com/public/product/image/49c/2000460991/IPROS82399171071451579834.png?w=280&h=280)
![[Information] Shirutoku Report No. 41 # Retrofitting Heat Measures, Additional Heat Measures Needed!](https://image.mono.ipros.com/public/product/image/a24/2000693884/IPROS12983595055864030718.jpeg?w=280&h=280)
![Prototype Development Service [Mechatronics/Case Studies]](https://image.mono.ipros.com/public/product/image/1b1/2000493567/IPROS30378326273227280386.jpeg?w=280&h=280)