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  3. Electronic Components and Modules
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  5. Circuit board design and manufacturing
  6. Information on various parts manufacturing

Information on various parts manufacturing

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last updated:Nov 15, 2021

甲斐エレクトロニクス 本社
甲斐エレクトロニクス 本社
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Coordinating the optimal Q (quality), C (cost), and D (delivery).

In manufacturing, the most important aspect is quality, but in electronic device development, both the development lead time and budget must also meet the requirements. Kai Electronics Co., Ltd. coordinates the optimal methods from a rich network. Whether it's prototype or mass production, prioritizing delivery or cost, double-sided boards or multilayer boards, surface mount or through-hole components, we maintain a network capable of responding to various demands. Furthermore, if you request a one-stop service from design to manufacturing, we can procure components simultaneously with the design process and create metal masks and programs for component mounting concurrently with the printed circuit board manufacturing process, thereby coordinating all processes to achieve shorter delivery times. All factories responsible for manufacturing manage their processes in compliance with ISO standards, ensuring the quality of the manufactured products.

    Circuit board design and manufacturing
部品製造.PNG

Information on various parts manufacturing

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部品製造.PNG
  • Related Link - http://www.kai-elc.co.jp/biz/manufacturing.html

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basic information

■Printed circuit board manufacturing ■Printed circuit board component assembly ■Harness manufacturing ■Enclosure component manufacturing ■Device assembly wiring

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Kai Electronics Co., Ltd. Company Profile

Kai Electronics Co., Ltd. Company Profile

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甲斐エレクトロニクス

甲斐エレクトロニクス 本社

Electronic Components and Semiconductors

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Kai Electronics Co., Ltd. is a group of design engineers. Within the company, there are three types of engineers specializing in system design, enclosure design, and printed circuit board design, allowing for designs that consider requirements from other processes and pursue optimal solutions from multiple perspectives. For example, we can examine ESD countermeasures from both electrical and mechanical aspects, confirm the interference between printed circuit boards and enclosures, select components based on interference information, and consider board size and layer count, making it easier to aggregate and review information from various design technologies. We are committed to gathering information beyond the boundaries of each of the three design technologies to meet the required specifications and achieve shorter delivery times. Our company is involved in the design of a wide variety of products without specialization in specific applications, handling over 200 new development projects annually for about 30 companies. With the expertise of our design engineers cultivated through these experiences and the coordination skills of our sales representatives, we fully support new product development.

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