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  6. Processing Technology "GTMS / Glass Processing"

Processing Technology "GTMS / Glass Processing"

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last updated:Nov 10, 2021

山村フォトニクス
山村フォトニクス
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By creating an oxidation film diffusion layer and chemically bonding it, high airtightness and high reliability are achieved.

We would like to introduce our processing technology, "GTMS/Glass Processing." With "GTMS technology," we diffuse the oxide film of the sealing alloy into the glass side, creating a layer (oxide film diffusion layer) that connects the metal and glass, achieving high airtightness and high reliability through chemical bonding. Additionally, we offer "glass processing technology," which involves creating each piece by hand, as well as "step seal processing technology" that enables the joining of metals and glass with different coefficients of expansion. 【Features】 <GTMS Technology> - Diffuses the oxide film of the sealing alloy into the glass side to create a layer that connects metal and glass. - Achieves high airtightness and high reliability through chemical bonding. <Glass Processing Technology> - Crafts high-quality glass processing parts by hand, one by one. - Capable of developing and considering soft glass, hard glass, and special glass. *For more details, please refer to the PDF materials or feel free to contact us.

    Processing ContractGlass
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Processing Technology "GTMS / Glass Processing"

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  • Related Link - https://www.yama-ph.co.jp/capabilities/

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【Other Features】 <Multi-layer Seal Processing Technology> ■ Joins glass with a thermal expansion coefficient similar to that of metal through multi-layer sealing, achieving airtight sealing with metal. ■ Enables airtight bonding of metals with materials such as quartz and hard glass, which typically cannot be bonded due to significant differences in thermal expansion coefficients. *For more details, please refer to the PDF document or feel free to contact us.

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Processing Technology "GTMS / Glass Processing"

Processing Technology "GTMS / Glass Processing"

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山村フォトニクス

山村フォトニクス

Electronic Components and Semiconductors

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Since its founding in 1949, we have developed our business based on the glass material technology and glass-to-metal sealing technology (GTMS) cultivated through glass products for vacuum tubes. Building on this accumulated technology, we have also aligned our innovations from vacuum tubes to semiconductors, and as a result of continuously providing various components that respond to the integration of light and electronics, our technology has now borne fruit in three business areas: "glass components for electrical and electronic devices," "optoelectronics packaging components," and "glass ceramics (LTCC)."

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