High melting point alloy compatible solder paste
This is a high melting point type of solder paste. It is ideal for mounting components with high heat generation, such as power semiconductors. It has good adhesion after printing and suppresses solder ball formation during heating. This allows for more stable mounting.
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basic information
【Specifications】 ■Compatible solder alloy: Sn5-Pb92.5-Ag2.5 ■Flux type: MIL-RMA ■Halide content: 0.10±0.04% ■Powder particle size: 45～25μm ■Flux content: 8±0.5%, 9.5±0.5% ■Copper plate corrosion test: No corrosion ■Copper mirror corrosion test: No corrosion ■Insulation resistance test (Ω): 5.0×10^8Ω or more ■Migration test: No occurrence
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Applications/Examples of results
High-heat generating components such as power semiconductors.
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Company information
Ishikawa Metal Co., Ltd. is a manufacturer and seller of lead-free and lead-containing solder, consistently engaged in solder production since its establishment. In addition to various types of rosin-core solder and solder paste, we also handle high-melting-point solder for semiconductors and flux for semiconductor mounting. We not only manufacture and sell unique solders, such as rosin-core solder for lasers and solder that can be used for aluminum and stainless steel, but we also propose solutions to customer issues such as splattering and wetting defects.