[Soldering Defects] Wet defects, bridges, horns (solder with flux)

basic information

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Detailed information

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  Wet defects, bridging, and solder balls are all issues caused by the activity of flux. Due to the heat during soldering, the flux loses its activity over time. By reviewing the work procedures and selecting the appropriate flux, it is possible to reduce these problems.

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  Changes that occur in flux during soldering The surfactants in the flux directly affect the wettability and activity of the solder. During soldering, the surfactants decompose and volatilize due to heat, leading to their consumption. It is important to suppress the volatilization of surfactants and to continuously supply fresh surfactants to the soldering area to prevent issues such as poor wetting.

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  Review of Soldering Work Processes Whether manual or robotic soldering, the timing of solder supply is extremely important. Instead of supplying a large amount of solder all at once to the soldering area, supplying it in small amounts ensures that fresh activator is always present at the soldering site, achieving good wetting. This is particularly true for robotic soldering, where the finish can vary significantly. Additionally, it is effective to review issues such as excessively high soldering iron temperatures, small heater capacity, and mismatched dimensions between components and the tip of the soldering iron.

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  Selection of Solder Materials The activators in the flux are selected to react at optimal temperatures according to the specific applications of each product. It is important to consult with the manufacturer and use solder that is suitable for the assembled products and methods. Our company offers solder with excellent wettability across a wide temperature range and for various assembled products. We can accommodate not only standard components but also high-difficulty assembled products such as through-hole PCBs, transformers, and large connectors.