Defect inspection device and defect removal device for thin film metal processing products.
CCTECH JAPAN
Automating defect inspection and removal of defective components in thin film metal processing products. Reducing manufacturing costs and labor expenses.
★Prest Kappar (Defect Inspection Device) Utilizing semiconductor inspection technology and advanced transport technology for miniaturized products, it excels in defect detection of a wide range of thin film metal processing sheets. Its unique algorithm for comparing adjacent products makes recipe creation easy. ★Razer Kappar (Defective Material Removal Device) This is a defective material removal device that uses handler transport technology employed in semiconductor manufacturing processes, used after defect inspection with Prest Kappar. It can automatically remove defective materials even if the target workpiece has minimal waviness or deformation. *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.*
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basic information
★Prest Kappar ● Compatible Workpieces: Metal processing products such as copper and stainless steel (flat processing products) VCM, leaf springs, etc. ● Workpiece Size: Dimensions: ~300x600mm (can exceed 300x600mm depending on options) ● Thickness: 10um ~500um ● Defect Types: (DOI) Burrs, dents, recesses, chemical residue, resist residue, foreign objects, bent metal pieces, etching defects, etc. ● Minimum Defect Size: 20~30um or more ● Throughput: 15 sheets/h (for 200x500mm) ● Defect Detection Algorithm: Target to Target method (CCTECH proprietary software correction processing) ● Others: Particle removal function ★Razer Kappar ● Compatible Workpieces: Metal processing products such as copper and stainless steel (flat processing products) VCM springs, leaf springs, etc. ● Workpiece Size: Dimensions: ~300x600mm (can exceed 300x600mm depending on options) Thickness: 10um~ (consultation required for laser output adjustment) ● Laser Removal Method: 3D Scan / Fiber Laser ● Throughput: 120 sheets/h (for 200x500mm)
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Applications/Examples of results
Defect inspection of thin film metal processing products and removal of defective components. VCM springs, lead frames, RFiD, etc.
Detailed information
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Defect inspection of metal processing products, defect removal device.
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Company information
A semiconductor inspection equipment manufacturer established in Hangzhou, China in April 2008. We develop and design wafer probers, testers, and handlers, supplying them to major semiconductor manufacturers. In 2017, we were listed on the Shenzhen Stock Exchange in China, established a Taiwan office, and in July 2018, we set up a Japan office. In 2019, we acquired Semiconductor Technologies & Instruments Ptd Ltd, an appearance inspection equipment manufacturer in Singapore, and in September 2020, we absorbed the semiconductor division of Sato Product Co., Ltd., providing better inspection equipment to the market for inspection equipment manufacturers.
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