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  5. Circuit Board Inspection Equipment
  6. Double-sided inspection solution for substrate assembly "DSI Series"

Double-sided inspection solution for substrate assembly "DSI Series"

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last updated:Aug 10, 2023

日本ミルテック
日本ミルテック
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Achieved reliable quality assurance through final dual-side inspection! Resolved the issues.

We would like to introduce our dual-sided inspection solution for printed circuit board assembly, the 'DSI Series.' By utilizing a dual-lane device, we solve the challenges of typical dual-sided inspection lines while significantly improving work efficiency. Additionally, by using the dual-lane model inspection device, the transport time of the boards can be eliminated, allowing for the inspection equivalent to two single-sided inspection devices. 【Features】 ■ Capable of inspecting the equivalent of two single-sided inspection devices ■ Line length is approximately 3.5m ■ Leads to a reduction in work time (transport time) ■ No need for empty magazine storage near the board supply and storage device ■ Contributes to increased productivity per unit area in the factory *For more details, please refer to the PDF document or feel free to contact us.

    Circuit Board Inspection Equipment
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Double-sided inspection solution for substrate assembly "DSI Series"

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【System Specifications (Partial)】 ■Camera Lens: Precision Telesentric Compound Lens ■Lighting Device: 8-Stage Color Lighting ■Oblique Camera System (Optional) ・10 Mega Pixel Digital Color Side Cameras (4 units) ・18 Mega Pixel Digital Color Side Cameras (4 units) ■Top Clearance: 45mm ■Bottom Clearance: 50mm *For more details, please refer to the PDF document or feel free to contact us.

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Double-sided inspection solution for substrate mounting "DSI Series"

Double-sided inspection solution for substrate mounting "DSI Series"

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日本ミルテック

日本ミルテック

Industrial Electrical Equipment

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Japan Mirtec Co., Ltd. was established in August 2013 as the Japanese subsidiary of the South Korean company MIRTEC. The South Korean MIRTEC is a specialized manufacturer of inspection equipment for the SMT assembly industry and the semiconductor industry. Recently, mobile devices, represented by smartphones, are becoming increasingly compact and high-functioning. In the field of appearance inspection equipment for printed circuit board electronic component assembly, which is essential for such products, the need for 3D image inspection equipment is growing increasingly compared to traditional 2D image inspection equipment. MIRTEC, established in 2000, has rapidly grown as a pioneer in this field and has gained the patronage of numerous customers worldwide. Additionally, aiming to become a global company, it has 16 subsidiaries and service locations around the world, including in the United States, China, and the United Kingdom. Based on the advanced technology cultivated so far, Japan Mirtec was established with the aim of developing the Japanese market and providing inspection solutions to Japanese companies expanding globally, as well as maintaining various equipment. We strive to achieve product quality and customer satisfaction as our top priority, and all employees are committed to this goal.

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