This is a 3D AOI device for substrate mounting that achieves a reduction in excessive detection.
The 3D AOI device for substrate assembly, "MV-6 EM OMNI," is a 3D AOI device that achieves a reduction in excessive detection. It projects moiré fringe light onto the mounted components and captures the reflected light with a camera. The height of the components can be measured from the phase shift of that light (reflective phase shift moiré method). Utilizing this principle, it measures the height of components and IC leads. Inspections for component lifting, IC lead lifting, and missing parts are conducted based on the differences in height. Compared to conventional 2D inspections, defect detection has significantly improved, thereby reducing the excessive detection issues that were challenges in 2D inspections. 【Features】 ○ OMNI-VISION(R) 2D/3D Inspection Technology ○ Avoidance of moiré fringe scattering effects ○ 8-stage color lighting ○ 10 Mega Pixel Side-Viewer(R) System For more details, please contact us or download the catalog.
Inquire About This Product
basic information
【Features】 ○ 3D OMNI-VISION®: Simultaneous 2D/3D inspection ○ Equipped with a 15 MegaPixel camera ○ Equipped with a 10 MegaPixel side camera ○ Compact design: Device width of 900mm ○ 8-stage color illumination: Complete coaxial illumination ○ Adoption of telecentric lenses ● For more details, please contact us or download the catalog.
Price information
Please contact us.
Delivery Time
※Please contact us.
Applications/Examples of results
For more details, please contact us or download the catalog.
catalog（2）
Download All Catalogs
Company information
Japan Mirtec Co., Ltd. was established in August 2013 as the Japanese subsidiary of the South Korean company MIRTEC. The South Korean MIRTEC is a specialized manufacturer of inspection equipment for the SMT assembly industry and the semiconductor industry. Recently, mobile devices, represented by smartphones, are becoming increasingly compact and high-functioning. In the field of appearance inspection equipment for printed circuit board electronic component assembly, which is essential for such products, the need for 3D image inspection equipment is growing increasingly compared to traditional 2D image inspection equipment. MIRTEC, established in 2000, has rapidly grown as a pioneer in this field and has gained the patronage of numerous customers worldwide. Additionally, aiming to become a global company, it has 16 subsidiaries and service locations around the world, including in the United States, China, and the United Kingdom. Based on the advanced technology cultivated so far, Japan Mirtec was established with the aim of developing the Japanese market and providing inspection solutions to Japanese companies expanding globally, as well as maintaining various equipment. We strive to achieve product quality and customer satisfaction as our top priority, and all employees are committed to this goal.
![[Exhibition Report] We exhibited at NEPCON Japan 2025!](https://image.mono.ipros.com/public/product/image/c7a/2001510480/IPROS11956591292795024490.jpg?w=280&h=280)
![[Exhibition Report] We exhibited at JPCAshow 2025!](https://image.mono.ipros.com/public/product/image/91f/2001532950/IPROS2732163172441887632.png?w=280&h=280)
