High-heat resistance tape can be used up to 350 °C. It is suitable for temporary fixing of electronic parts manufacturing process.
iCas F-TR has unique characteristics to increase adhesion temporary by heating then to reduce adhesion strength by continuing heating. Therefore, even under high-temperature environments, the tape adheres firmly to the substrate and can be easily removed after the process has been completed without leaving any adhesive residue. In addition, since additional process such as heating or UV irradiation is not required when peeling off the tape, it is also possible to improve work efficiency. The tape is suitable for temporary fixing applications in manufacturing process of electronic parts, etc. [Features] - Capable to adhere to various materials at room temperature (Ex. copper, gold, alumina, silicon, etc). - Compatible with reflow process and dry/wet process such as plasma flux cleaning. - Able to be peeled off at room temperature after heat treatment process (thermal peeling is possible). - Possesses superior chemical resistance against various chemicals such as toluene, THF, IPA, etc. - Designed as PFAS-Free formulation. [Application] - Components carrier tape in the manufacturing process. - Temporary fixing to backside of substrates such as silicon, glass, alumina for FO-WLP. - Masking use under high temperature environment (plating, soldering, thermal spraying, etc.) - Preventing mold resin bleed of lead frame package.
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Applications/Examples of results
- For the transport of electronic components - Temporary fixation of the back surface of silicon, glass, and alumina substrates such as FO-WLP - Masking in high-temperature environments (plating, soldering, thermal spraying, etc.) - Prevention of resin leakage in lead frame packages
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Company information
In June 1914, TOMOEGAWA started its path as a pioneer of industrial specialty paper in Japan, and succeeded in domestic production of “electrical insulating paper and telecommunications paper” to meet the needs of telecommunications industry. In the 1960s, we earned a reputation as a 'Tomoegawa of Specialty' by developing papers for multiple industries, with our strength in integrated production from wood pulp. Since then, TOMOEGAWA has developed "papermaking, coating, adhesive, powder" technologies and expanded its business domains to "highly functional materials." In recent years, with the spread of 5G, advanced driver assistance systems, etc., and the promotion of DX, many electronic parts require control for high voltage, high current, high frequency. TOMOEGAWA has expanded our "iCas" brand products that control "heat, electricity, and electromagnetic waves" to produce various solutions for heat, noise, etc. TOMOEGAWA has also formed “GREEN CHIP” brand, focusing on new products that contribute to the conservation of the natural environment and control of manufacturing and operating environments. In addition, we have changed our company name from TOMOEGAWA Co., Ltd., to TOMOEGAWA CORPORATION on January 1, 2024, in order to clarify the actual situation of our company and aim for sustainable corporate growth.