We will exhibit at "SEMICON Japan 2025."

Excellent adhesive performance even on thin films, achieving both high adhesive strength and workability. Replacement from glue to the film contribute to improve efficiency of manufacturing

The conventional liquid type adhesive has high adhesion strength and high heat resistance, however, its workability is an issue in comparison with adhesive tape. TOMOEGAWA's adhesive film contributes to improving workability while maintaining high adhesive strength and heat resistance, by molding to sheet form with thermo-setting adhesive by our own developed process. Can be customized according to the customer's request (adhesive strength, adhesive thickness, curing condition, etc.) Example: Short time curing type (At 180°C for 6 minutes, a peel strength of 10N/cm is achieved for aluminum and stainless steel.） [Features] - Available in thin films (Min.5μm), contributing to low-profile and low thermal resistance of parts. *Please contact us for thickness of less than 5 μm. - Replacement from glue to the film contributing to reduce the use of solvent in manufacturing site - Sheet type provides eliminating the need for care against overflow and coating amount control, which are required for liquid type adhesive. - Can be stored at room temperature [Application] - Passive parts (chip resistor, etc.) - Automotive parts - Circuit substrate materials such as FPC and FFC - Various equipment parts and jigs

• Other polymer materials

Sheets produced using papermaking technology combine “the heat and corrosion resistance of stainless steel" and “the flexibility and processability of paper"

[Features] - Being lightweight and flexible, it contributes to space saving and design freedom of the product - Adhesive can penetrate the porous parts, making it effective for creating a strong bond - Its high heat, water, and chemical resistance make it suitable for use in harsh environments such as vehicles and outdoor applications - Customization according to the required properties is possible by controlling fiber diameter and thickness. [Application] - Flexible Planar Heater - Lightweight and thin electromagnetic wave shield materials - Acoustic transmission boards that reduce wind noise

• Non-ferrous metals
• stainless
• Other metal materials

Planar heater that use Stainless Fiber Sheet. It conforms closely to the part to be heated, so efficient heat transfer is possible.

[Features] - Planar heater that use Stainless Fiber Sheet - Efficient heat transfer because of close-fitting of heater and object to be heated due to high flexibility - Able to fit closely to complex shape such as piping, and is able to be wrapped around the object to be heated - Quick heating and cooling due to the porous structure - Uniform heat generation due to unique metal fiber sheet [Application] - Various equipment - Devices that use heater (curve surfaces, narrow region) etc. This product is designed and customized optimally to meet client's requirements. Please share your requirements with us.

• stainless

High-heat resistance tape can be used up to 350 °C. It is suitable for temporary fixing of electronic parts manufacturing process.

iCas F-TR has unique characteristics to increase adhesion temporary by heating then to reduce adhesion strength by continuing heating. Therefore, even under high-temperature environments, the tape adheres firmly to the substrate and can be easily removed after the process has been completed without leaving any adhesive residue. In addition, since additional process such as heating or UV irradiation is not required when peeling off the tape, it is also possible to improve work efficiency. The tape is suitable for temporary fixing applications in manufacturing process of electronic parts, etc. [Features] - Capable to adhere to various materials at room temperature (Ex. copper, gold, alumina, silicon, etc). - Compatible with reflow process and dry/wet process such as plasma flux cleaning. - Able to be peeled off at room temperature after heat treatment process (thermal peeling is possible). - Possesses superior chemical resistance against various chemicals such as toluene, THF, IPA, etc. - Designed as PFAS-Free formulation. [Application] - Components carrier tape in the manufacturing process. - Temporary fixing to backside of substrates such as silicon, glass, alumina for FO-WLP. - Masking use under high temperature environment (plating, soldering, thermal spraying, etc.) - Preventing mold resin bleed of lead frame package.

• Other polymer materials
• Other consumables

We want to improve our operations with AI, but what exactly can we do... For those who want to actually try out and compare services, we have an announcement. The electronic contract and document management service paperlogic will be exhibiting at the 'Business Innovation Fair 2025 Autumn in Makuhari' hosted by Otsuka Shokai on November 13th (Thursday) and 14th (Friday) at the Hotel Green Tower Makuhari. Seminars on business improvement and AI utilization will also be held, so if you are nearby, please come and visit us. ● We will also be conducting product demonstrations of paperlogic at the venue. The biggest feature of paperlogic is that it is easy to use and simple, yet it complies with all document management regulations, including the Electronic Bookkeeping Act. We invite you to experience this simplicity firsthand.

What should we start with for the digital transformation (DX) in the quality assurance department? ■ Transitioning from manual input to automatic input for inspection sheet creation! ■ Connecting measurement result input tasks to digital calipers for automatic judgment! We propose to not only maximize the use of CAD drawings to streamline inspection operations but also to initiate the digital transformation starting from inspection tasks.

The electric actuator manufacturer LINAK will be exhibiting for the first time at the "International Robot Exhibition (iREX 2025)" held at Tokyo Big Sight. This exhibition is highly regarded both domestically and internationally as "one of the largest robot specialized exhibitions in the world." At the venue, we plan to showcase our lifting column "LC3 IC Elevate," which is suitable for lifting applications with collaborative robots, as well as electric cylinder solutions for AGV/AMR. We will propose sustainable and flexible automation solutions. Please be sure to visit our booth.

Fuji Chemical Co., Ltd. will be exhibiting at the "39th Hokkaido Business EXPO" held at Access Sapporo. This exhibition is one of the largest business events in Hokkaido. We plan to showcase GRP pipes for wastewater, pipes for hot springs, and pipes for plants. We sincerely look forward to your visit.

Fujikako Co., Ltd. will be exhibiting at the "17th International Food Trade Fair Food Messe in Niigata 2025," held at the Toki Messe Niigata Convention Center. This exhibition is an "International Comprehensive Food Trade Fair" that creates new value from tradition to advanced trends, bringing together participants from across the country to Niigata and from Niigata to the nation. We plan to showcase our Fuji GRP pipes for wastewater. We sincerely look forward to your visit.