We will exhibit at "SEMICON Japan 2025."

Excellent adhesive performance even on thin films, achieving both high adhesive strength and workability. Replacement from glue to the film contribute to improve efficiency of manufacturing

The conventional liquid type adhesive has high adhesion strength and high heat resistance, however, its workability is an issue in comparison with adhesive tape. TOMOEGAWA's adhesive film contributes to improving workability while maintaining high adhesive strength and heat resistance, by molding to sheet form with thermo-setting adhesive by our own developed process. Can be customized according to the customer's request (adhesive strength, adhesive thickness, curing condition, etc.) Example: Short time curing type (At 180°C for 6 minutes, a peel strength of 10N/cm is achieved for aluminum and stainless steel.） [Features] - Available in thin films (Min.5μm), contributing to low-profile and low thermal resistance of parts. *Please contact us for thickness of less than 5 μm. - Replacement from glue to the film contributing to reduce the use of solvent in manufacturing site - Sheet type provides eliminating the need for care against overflow and coating amount control, which are required for liquid type adhesive. - Can be stored at room temperature [Application] - Passive parts (chip resistor, etc.) - Automotive parts - Circuit substrate materials such as FPC and FFC - Various equipment parts and jigs

• Other polymer materials

Combines the heat resistance and electromagnetic shielding of stainless steel with the flexibility and processability of paper

A sheet made entirely of stainless steel fibers, produced using advanced papermaking technology. We offer functional sheets that combine stainless steel’s heat resistance and electromagnetic shielding with the flexibility and processability of paper. [Features] 1. Heat resistance, corrosion resistance, and chemical resistance - Superior heat and chemical resistance of stainless steel for harsh environments such as automotive and outdoor applications 2. Electrical resistance control - Electrical resistance controlled through basis weight and thickness adjustment - Sheet heater functionality through conductivity - Uniform surface heating capability 3. Electromagnetic shielding - Lightweight, thin, and flexible electromagnetic shielding material leveraging stainless steel properties 4. Flexibility like paper - Durable sheet maintaining performance in bent configurations 5. Customized shape processing - Easy workability with scissors - Shape processing such as bending and forming - Various coating surface treatment

• Non-ferrous metals
• stainless
• Other metal materials

Planar heater that use Stainless Fiber Sheet. It conforms closely to the part to be heated, so efficient heat transfer is possible.

[Features] - Planar heater that use Stainless Fiber Sheet - Efficient heat transfer because of close-fitting of heater and object to be heated due to high flexibility - Able to fit closely to complex shape such as piping, and is able to be wrapped around the object to be heated - Quick heating and cooling due to the porous structure - Uniform heat generation due to unique metal fiber sheet [Application] - Various equipment - Devices that use heater (curve surfaces, narrow region) etc. This product is designed and customized optimally to meet client's requirements. Please share your requirements with us.

• stainless

High-heat resistance tape can be used up to 350 °C. It is suitable for temporary fixing of electronic parts manufacturing process.

iCas F-TR has unique characteristics to increase adhesion temporary by heating then to reduce adhesion strength by continuing heating. Therefore, even under high-temperature environments, the tape adheres firmly to the substrate and can be easily removed after the process has been completed without leaving any adhesive residue. In addition, since additional process such as heating or UV irradiation is not required when peeling off the tape, it is also possible to improve work efficiency. The tape is suitable for temporary fixing applications in manufacturing process of electronic parts, etc. [Features] - Capable to adhere to various materials at room temperature (Ex. copper, gold, alumina, silicon, etc). - Compatible with reflow process and dry/wet process such as plasma flux cleaning. - Able to be peeled off at room temperature after heat treatment process (thermal peeling is possible). - Possesses superior chemical resistance against various chemicals such as toluene, THF, IPA, etc. - Designed as PFAS-Free formulation. [Application] - Components carrier tape in the manufacturing process. - Temporary fixing to backside of substrates such as silicon, glass, alumina for FO-WLP. - Masking use under high temperature environment (plating, soldering, thermal spraying, etc.) - Preventing mold resin bleed of lead frame package.

• Other polymer materials
• Other consumables

Sekisui Filler Co., Ltd. will exhibit at the "Automotive Technology Exhibition 2026 YOKOHAMA" held at PACIFICO YOKOHAMA from May 27. (Booth number 285, within the Sekisui Chemical booth) 【Exhibited Products】 Mobility G - Re-sealable gasket HM (EV Seal 500) - Interior materials (Thermonex/Swiftlock) - Battery protection materials (EV Protect 4006SFR, etc.) Electronics / Automotive Electronics - Adhesives for camera modules - Adhesives for displays - Conformal coatings - Optical adhesives We sincerely look forward to your visit.

Dear Sir or Madam, We hope this message finds you well and that your company continues to prosper. FUKUDA will be exhibiting at the 28th INTERPHEX Week Tokyo. At the exhibition, we will be showcasing 100% inspection equipment compliant with Container Closure Integrity Testing (CCIT) standards, as well as sampling inspection machines. We sincerely invite you to visit our booth at this opportunity and would greatly appreciate your attendance despite your busy schedule. Yours sincerely, [Dates] May 20 (Wed) - 22 (Fri), 2026 10:00-17:00 (JST) [Venue] Makuhari Messe, Japan 8 Hall Booth No. 41 - 36

[Instructor] Hiroto Hayashi, Attorney at Law, New York State, Mori Hamada & Matsumoto Law Firm, Foreign Law Joint Enterprise [Key Lecture Content] Recently, batteries are expected to serve as a balancing power source for the realization of renewable energy as a primary power source. Due to changes in the business environment brought about by market development and government support measures, opportunities in the battery business are expanding. For grid-connected batteries, there are multiple options for long-term decarbonization power source auctions, tolling models, and merchant models, and the points of project development vary depending on the offtake method. Additionally, with the spread of the FIP system, the installation of batteries alongside renewable energy generation facilities is also progressing. In this lecture, we will explain the systems related to batteries, as well as key points for contract creation and negotiation, and financing necessary to steadily advance projects. We will also outline the challenges and prospects for project development and project finance formation according to each offtake scheme.

[Lecturer] Hideo Yamada, Ph.D. Honorary Professor, Waseda University Visiting Professor, Business Breakthrough University Graduate School [Key Lecture Content] Companies face various trade-offs (dilemmas) such as quality vs. cost, inventory levels vs. service levels, and standardization vs. differentiation. Traditionally, companies have responded to trade-offs by (1) finding a balance or (2) prioritizing one over the other. However, this does not lead to fundamental solutions. In this lecture, I will propose a third method that is neither balancing nor prioritizing. Using case studies from over 50 Japanese companies, I will explain it in an easy-to-understand manner. If we can turn long-standing trade-offs into trade-ons (coexistence), business opportunities will arise. [Lecture Topics] 1. What is a trade-off? 2. Trade-offs between customers and companies 3. Trade-offs within companies 4. Trade-offs within customers 5. How to turn trade-offs into trade-ons 6. Steps for exploration 7. Q&A / Business card exchange

[Lecturers] Corporate Partner, Nishimura & Asahi Law Office Osaka, Mr. Satoshi Niki Associate, Nishimura & Asahi Law Office - Foreign Law Joint Enterprise, Mr. Shu Numazawa [Key Lecture Content] In recent years, the diversification of defense cooperation and advancements in dual-use technology have significantly changed the management and international sharing of advanced technologies. This lecture will clarify the basic structure of Article 3 of the Japan-U.S. Technology Agreement and the significance of "similar treatment," while explaining the institutional transformation brought about by the introduction of the non-public patent application system under the Economic Security Promotion Act. Furthermore, considering the relationship between this system and the Japan-U.S. Technology Agreement, we will examine how to reposition the patent applications and secrecy management of defense-related technologies within the context of expanding international joint research and multilateral defense cooperation. [Lecture Items] 1. Diversification of defense cooperation and advancements in dual-use technology 2. Basic structure of Article 3 of the Japan-U.S. Technology Agreement 3. Practical application of "similar treatment" 4. Introduction of the non-public patent system (Economic Security Promotion Act) 5. Relationship between the non-public patent system and Article 3 of the Japan-U.S. Technology Agreement 6. Expansion of international joint research and reevaluation of Article 3 7. Q&A / Business card exchange