High hardness thin film capable of forming at low temperatures. Low surface energy, low adhesion.
MiCC is a CrN film coated using the FCVA method. It is suitable as a release film for semiconductor package molds and injection molding molds. Since the coating is performed at low temperatures, there is no deformation or alteration of the substrate material. In addition to the metal film (MiCC), it is also possible to coat hydrogen-free DLC (TAC) films. 【Features of MiCC】 ■ Low surface energy (improved release properties) ■ Low-temperature synthesis (>150℃) ■ High hardness (~20GPa) ■ Excellent adhesion (critical load >80N @ 200um tip) ■ Low friction coefficient 【Application Fields】 ■ Semiconductor encapsulation package molds ■ Injection molding molds ■ Rubber molding molds For more details, please refer to our website.
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Our development technology has obtained international patents and plays a significant role in society. The super DLC (hydrogen-free ta-C film) produced by the FCVA method is formed through a completely different process compared to DLC films generated by existing PVD and CVD methods. Additionally, there is a composite metal film called "Micc film" that excels in release properties between metals and plastics. Coating films produced by the FCVA method are currently being rapidly adopted in fields such as the hard disk industry, precision machinery industry, and semiconductor industry, and future expansion into the automotive industry, nanoimprint industry, and biomaterials field is anticipated.
![[Example] Preventing metal migration due to moisture in multilayer printed circuit boards.](https://image.mono.ipros.com/public/product/image/984/2000640006/IPROS21370121225881087240.jpeg?w=280&h=280)
