Stable supply of high-precision micro terminals and micro pins is possible!
FineNex manufactures and sells Cu pillars with diameters ranging from 60μm to several hundred μm, intended for narrow pitch mounting in 2.5D and 3D packages. Utilizing our own equipment and molds, we achieve high-precision processing technology that ensures stable dimensional accuracy, enabling production capabilities of hundreds of millions to billions of units per month. Leveraging our long-standing experience in manufacturing micro terminal pins, we can provide a stable supply of high-precision micro terminals and micro pins that can be used as copper pillars, copper posts, and copper pins. 【Features】 ■ Expected to be used as interconnects for embedded substrates and pins for interposers in semiconductor packages with POP structures used for high-speed communication. ■ Arranging micro-diameter copper pins in a cylindrical post shape to accommodate narrower pitches. ■ Providing electrical connections as interconnects for semiconductor chips and packages, as well as interposers. ■ Achieving narrow pitch while allowing for free design in the height direction. ■ Strengthening bonding strength by transitioning from point contacts to surface contacts. *For more details, please refer to the related links or feel free to contact us.
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basic information
【Reference Specifications】 ■ Diameter: 0.06mm and above (straight pins, single header pins (T-pins)) ■ Shape: Straight type (cylindrical), header (T-pin) type, etc. ■ Material: Copper-based metals, various copper alloys ■ Plating surface treatment specifications: Sn (tin) plating, Ni (nickel) plating, Au (gold) plating, SAC305, etc. *For more details, please refer to the related links or feel free to contact us.
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Applications/Examples of results
【Main Uses】 ■ Copper pillars, copper posts, and copper columns as interconnect pins within semiconductor packages Various semiconductor IC package connection terminal pins, including PoP, FOWLP, SiP, SoC, 2.5D/3D packages, and terminal pins for interposers. *For more details, please refer to the related links or feel free to contact us.
Company information
Through years of accumulated expertise in the plastic processing technology of wire materials, we are capable of producing a wide range of products, from micro pins with a wire diameter of φ100μm or less to large forged parts for automobiles, all through header forging processing. With over 2,000 in-house processing machines, we have established a mass production system for some of the world's leading forged components. For PGA terminals used in CPUs for personal computers, where we have achieved a top global market share, we supply over 10 billion units monthly, contributing to the advancement of the IT society. Leveraging our know-how in forging processing, we respond to the needs of customers across various fields, including consumer goods, automotive, and medical applications. Additionally, we possess a consistent manufacturing line that extends from forging processing to plating, press processing, insert molding, and assembly of components, allowing us to provide parts with higher added value by combining various processing methods, not just limited to forging. We also cater to a wide range of needs, including OEM assembly of high-quality parts such as automotive sensor components and other vehicle parts that require stringent quality standards.
