【Examples of Product Applications for Plating】Electrolytic and Electroless Plating on Semiconductor Wafers
We will introduce the advantages and disadvantages of electroplating and electroless plating!
The purpose of plating on semiconductors includes the formation of UBM (Under Bump Metal, Under Barrier Metal), the formation of solder bumps, and wiring formation. Additionally, there are methods for film formation using both electrolytic plating and electroless plating, but it is necessary to set the method and plating specifications based on factors such as electrode size, plating metal, and bonding methods. On our company website, we will introduce the advantages and disadvantages of both electrolytic plating and electroless plating, as each method has its strengths and weaknesses. For more details, please refer to the related links below. [Content Included] ■ Purpose of plating on semiconductors ■ Advantages and disadvantages of electrolytic/electroless plating on semiconductor wafers ■ Summary *For more details, please refer to the PDF materials or feel free to contact us.
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Through the miniaturization of products using our unique nano-plating technology, we promote resource conservation and energy efficiency to protect the global environment, ensuring that even hundreds of billions of components can be produced without a single defect, thereby providing safety and peace of mind to society. This philosophy will be passed down forever as long as the company continues, regardless of how times change. Kiyokawa Plating will continue to provide technology that is always needed by our customers, ensuring their satisfaction and inspiring them.
![[Plating Testing and Evaluation Methods] Characteristics of Plating - The strength of plating is surprisingly large.](https://image.mono.ipros.com/public/product/image/e27/2000674287/IPROS98299381950537785992.png?w=280&h=280)
