McDermid Solder Paste "ULT1 OM-220"
McDermid Performance Solutions Japan Co., Ltd.
It is suitable for various applications, such as products where substrates and components with low heat resistance may be mounted!
The solder paste "ULT1 OM-220" is a super low melting point product developed for mounting on substrates and components with low heat resistance. It allows for mounting at a peak temperature of 150°C or lower during reflow, enabling secondary mounting without re-melting boards that have been mounted with "SAC305." This product is suitable for various applications, including consumer electronics, in-cabin automotive products, and medical products, where there is a possibility of mounting on substrates and components with low heat resistance. 【Features】 ■ Peak temperature during reflow: 150°C or lower ■ Mounting of low-cost substrates and components ■ Reduced warpage of substrates and components during mounting compared to SAC (Sn/Ag/Cu) solder ■ Excellent electrical reliability (clears JIS Z 3197 and J-STD-0004B surface insulation resistance tests) ■ Low voids (meets IPC-7095 Class 3: BGA) *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Product Features (Partial)】 ■ Printing Process Window ・Printability ・Adhesion/On-Board Life ・Printing Speed ■ Yield During Assembly ・Reflow Atmosphere ・Low Voids ・Solder Ball Reduction ■ Electrical Reliability ・IPC Surface Insulation Resistance Test ・JIS Surface Insulation Resistance Test ・Flux Classification ■ Environmental Aspects ・Halogen Substance Content Rate *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（2）
Download All Catalogs
Company information
The development of electronics has given people great dreams and has turned those dreams into reality, one by one. This development has been passed on to the 21st century, inspiring even greater dreams and hopes. I am deeply grateful and delighted to have been able to engage in work that contributes to this segment of the electronics industry. Moving forward, I will continue to serve as a conduit for the appropriate information on semiconductors and electronic components, so that I can help realize humanity's great dreams and support the product and information development of our clients. I am committed to walking alongside our clients and growing together in the information society of the 21st century. However, on the other hand, global environmental issues have become increasingly prominent. As a member of society, I feel the importance of leaving a rich natural environment for the future and preserving the fundamental value of humanity. I am determined to strive towards becoming a company that harmonizes with nature and society as we move towards an endless future.