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  5. Printed Circuit Board
  6. High-speed thick copper plating method for high thermal conductivity high-frequency substrate development.

High-speed thick copper plating method for high thermal conductivity high-frequency substrate development.

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last updated:Feb 27, 2024

キョウデン
キョウデン
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Challenges related to mass production that were previously unattainable, substrate reliability, and thin plate compatibility have also been cleared.

"Kyoden's Latest Technology: High-Speed Thick Copper Plating Method" This new technology has enabled the development of high heat dissipation, high-frequency substrates. 【Features】 ♢ Overcomes challenges in mass production, substrate reliability, and thin plate compatibility that were previously unattainable ♢ Technology that can also be used for build-up substrates ♢ Compatible with 5G/6G and power semiconductor components ◎ *For more details, please refer to the related links or feel free to contact us.

    Printed Circuit Board
technology-illust01-2.png

High-speed thick copper plating method for high thermal conductivity high-frequency substrate development.

technology-illust01-2.png
technology-illust01-2.png
  • Related Link - https://www.kyoden.co.jp/advanced-technology

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Compatible with thin substrates of 0.4mm or less, which are difficult to handle with copper inlays! Various substrates such as power component boards and power module boards that require high heat dissipation.

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5G/6G base stations, compatible with power semiconductors! 【High-speed thick copper plating method】

5G/6G base stations, compatible with power semiconductors! 【High-speed thick copper plating method】

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キョウデン

キョウデン

Electronic Components and Semiconductors

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Kyouden Co., Ltd. is a comprehensive manufacturer of printed circuit boards. In addition to printed circuit boards, we provide comprehensive manufacturing support for all processes involved in manufacturing. By owning all processes in-house, we have established a unique "fully in-house convenience factory" that is not found in other EMS manufacturers. We manufacture build-up boards, high-layer count boards, and through-hole boards with high quality and short delivery times, providing full support from prototyping to mass production. We utilize cutting-edge technology to accommodate 5G communication, high-frequency, high-density, and high-heat dissipation boards. Feel free to let us know if you only want to use part of a process or if you want to use processes from this step to that step. Our strength lies in our ability to respond flexibly from any process. Please make use of Kyouden as a convenient factory for your needs!

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