Corresponding to the 'density' of components! High-frequency build-up substrate.
What supports KyoDen's narrow adjacent mounting technology is not just the mounting technology itself. It is unique to KyoDen that we can also offer solutions from substrate manufacturing technology, design, and analysis.
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basic information
♢ Compatible with 0.4mm pitch BGA ♢ Compatible with "0201" SMD chips ♢ High-reliability high-frequency materials and multi-layer build-up PCBs Optimal placement of decoupling capacitors based on analysis during design. Multi-layer build-up using high-frequency materials. We provide a one-stop service from design to implementation. *For more details, please refer to the related links or feel free to contact us.*
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Applications/Examples of results
- IoT-related devices - Wearable-related devices - Server cards - Small sensing modules - Small wireless modules : * In providing products, Kyoden also implements improvement proposals aimed at ensuring reliability.
Company information
Kyouden Co., Ltd. is a comprehensive manufacturer of printed circuit boards. In addition to printed circuit boards, we provide comprehensive manufacturing support for all processes involved in manufacturing. By owning all processes in-house, we have established a unique "fully in-house convenience factory" that is not found in other EMS manufacturers. We manufacture build-up boards, high-layer count boards, and through-hole boards with high quality and short delivery times, providing full support from prototyping to mass production. We utilize cutting-edge technology to accommodate 5G communication, high-frequency, high-density, and high-heat dissipation boards. Feel free to let us know if you only want to use part of a process or if you want to use processes from this step to that step. Our strength lies in our ability to respond flexibly from any process. Please make use of Kyouden as a convenient factory for your needs!