Plasma Dicing Equipment 'MDS-100/MDS-300'

Supports multiple wafer sizes! Dicing using the Bosch process with inductively coupled plasma.

The "MDS-100/MDS-300" is a plasma dicing device that utilizes inductively coupled technology, enabling stable and uniform continuous processing of 25 wafers with high-output plasma. It allows processing while maintaining high uniformity without causing damage to the wafers, similar to that caused by saws or lasers. Using the Bosch process with a high-speed gas switching system, it achieves excellent sidewall shape and processing of free shapes, providing superior dicing strength compared to existing methods. 【Features】 ■ Contributes to improved die quality, yield, and freedom of die shape with excellent processing capability ■ Supports multiple wafer sizes (MDS-100: φ4" to 8", MDS-300: φ8" to 12") ■ Dicing using Bosch process with inductively coupled plasma ■ Achieves fast and stable step switching through a high-speed gas switching system ■ Allows setting of parameter morphing and its fluctuation trends *For more details, please refer to the PDF document or feel free to contact us.

Wafer processing/polishing equipment