Conducting thermal fluid analysis of the slot die! It is possible to calculate the temperature changes of the ink and the die.
This article introduces a case study of thermal fluid analysis of a coating die using AcuSolve. Using the general-purpose thermal fluid analysis software AcuSolve, we conduct thermal fluid analysis of a slot die, allowing inks with different physical properties and temperatures to flow in from the inlet. We investigate the spread of the resin and the temperature changes of the mold. We can visualize the spread of the fluid flowing through a narrow channel by coloring it and observing the fluid that enters from a specific inlet. 【Contents】 ■ Overview ■ Model Description and Calculation Conditions ■ Physical Property Values ■ Analysis Results ■ Conclusion *Detailed information about the case study can be viewed through the related links. For more information, please feel free to contact us.
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basic information
【Summary】 ■ Able to calculate temperature changes of ink and dye ■ Can color the fluid flowing through narrow channels and visualize the spread of fluid that has entered from a specific inlet ■ Capable of arbitrarily changing physical property values based on temperature dependence ■ Can set Bingham fluids, Carreau fluids, etc. ■ Users can customize and set any physical property values *Details of the case can be viewed through the related links. For more information, please feel free to contact us.
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*The details of the case can be viewed via the related link. For more information, please feel free to contact us.*
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● We support the R&D and production processes of the manufacturing industry with CAE technology. ● We propose efficient problem-solving methods to meet various CAE-related needs of our customers.
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