Electrolytic nickel plating with soldering properties equivalent to that of tin.

Are you having trouble with whisker issues? Please feel free to consult with us! We can provide a plating film without whisker formation!

Solderable nickel plating is an original technology developed by our company, providing electrical nickel plating with solderability equivalent to tin plating. Since it is nickel plating, whiskers do not occur from the plating film! Tin plating has excellent solderability, but it has the drawback of whisker generation. When whiskers grow at the connection points of electronic circuits, it can lead to shorts and the following issues: - System downtime - Equipment failure - Accidents such as fires "Our plating has good solderability like tin plating and is effective against whiskers!" This is possible with our company! Over 10 years have passed since its development, and it has a proven track record with many customers adopting it. Solderable nickel plating uses only nickel sulfate, nickel chloride, boric acid, and a gloss agent (equivalent to widely used commercial products) as liquid components. Since no additives to improve solder wettability are used, we do not use any substances that would violate the RoHS directive or REACH regulations. We can provide samples for solderability evaluation tests, so please feel free to contact us.

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