Rework System <Manufacturing Business>

Rework and reballing of BGA/CSP! We enable regeneration tailored to our customers' needs.

We would like to introduce our "Rework System." By adopting a powerful bottom heater, it is capable of handling multilayer boards with a thickness of 4mm, which have been considered difficult to repair. Reliable and high-quality repairs are achieved through temperature profile measurements using a data logger. With extensive experience in high-density mounting, we enable regeneration tailored to our customers' needs. 【Features】 ■ Supports large substrates up to: 458mm x 560mm ■ Capable of handling multilayer boards with a thickness of 4mm, which have been considered difficult to repair ■ Holds multiple dedicated nozzles tailored to devices, and custom manufacturing is possible ■ Achieves reliable and high-quality repairs through temperature profile measurements using a data logger *For more details, please refer to the PDF document or feel free to contact us.

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