What is prototype component implementation? A thorough explanation of its advantages and disadvantages!
30 years of experience in prototype board assembly! An explanation of the advantages and disadvantages of prototype component assembly, along with know-how. Technical materials on underfill BGA rework are also available!
"Prototyping and Implementation" refers to the stage before mass production, where small to medium quantities are produced. During this phase, we confirm electrical compatibility and functionality, and sometimes make specification changes, which can be seen as the "preparation" for a safer transition to mass production. ■Advantages By conducting performance evaluations before mass production implementation, we can avoid unexpected issues during mass production and prevent significant modifications in advance, thus mitigating impacts on schedules and costs. By adapting to the situation and conducting "prototypes of prototypes" or "prototypes of prototypes of prototypes," we can enhance the effectiveness of this process. ■Disadvantages It may be necessary to purchase cut parts or individual components, which can be overly cumbersome. In factories that are engaged in mass production, there may not be enough processes available to dedicate to low-quantity prototype boards. *For more details, please refer to the PDF document or feel free to contact us.
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【Features】 ■ Capable of machine mounting for cut and loose parts ■ Striving to maintain delivery times and quality by utilizing a rich in-house inventory ■ Conducting prototype component mounting work in three patterns 【Types of Prototype Component Mounting】 ■ Manual placement: Components are mounted using hand soldering ■ Manual loading: After printing paste solder, components are manually placed and soldered using reflow ■ Mounter: Both component placement and soldering are done by machine *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.