We have multiple workers with over 10 years of experience, including one J-STD specialist! We can handle prototypes starting from a single piece using technology compatible with 0201 chips.
In response to various needs for "manual assembly," K-All employs highly skilled technicians who have received advanced internal certification to carry out the work responsibly. We also accommodate special materials such as flexible substrates, aluminum, and ceramics, which have high heat dissipation effects. Furthermore, we can handle a wide range of components, from connectors and QFPs with a pitch of 0.4mm to microchips. You can also entrust us with reflow-incompatible components, such as PWBs larger than 500mm, with a thickness of over 4mm, and components with varying heights and heat resistance. 【Features】 ■ Capable of manual assembly for 0201 chips ■ Manual soldering for connectors and QFPs with a narrow pitch of 0.4mm is possible ■ Manual assembly for high-difficulty components is feasible ■ Manual assembly for flexible substrates is also possible ■ We support both eutectic solder and lead-free solder *For more details, please refer to the PDF document or feel free to contact us.
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Efforts to Create Quality Products ■ Based on soldering conditions, work is conducted in an organized environment where workstations and tools are identified and arranged. ■ By creating unique drawings, an efficient and safe system is implemented that allows all stakeholders to grasp the details of the implementation at a glance. ■ A thorough inspection of each assembled board is conducted at every stage. ■ Solder inspections are carried out within the process before handing over to the next stage. ■ Devices and circuit boards that are sensitive to moisture are managed with a MacDry before assembly. *For more details, please refer to the PDF document or feel free to contact us.*
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【Proven Track Record】 ■0402 Chip ■0201 Chip *For more details, please refer to the PDF document or feel free to contact us.
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Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.
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