This is a thick line wedge bonder that can be utilized in prototype development scenes with its light footwork and excellent operability.
The "Thick Wire Semi-Auto HB30" is a newly added compact and low-cost desktop prototype machine specifically designed for thick wire, featuring excellent operability for power modules. It is ideal for the prototype development and small-scale production of thick wires. Its features include automatic height setting, loop profile functionality, profile modification and saving via touch panel operation, and the agility characteristic of a desktop machine. 【Features】 ■ Dedicated to thick wire ■ Compact ■ Low-cost ■ Excellent operability ■ Suitable for prototype development and small-scale production of thick wires *For more details, please refer to the PDF document or feel free to contact us.
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【Other Features】 ■ Automatic height adjustment is possible ■ Profile changes and saving can be done via touch panel operation ■ Lightweight and agile ■ High functionality ■ Loop shape control *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Leave manual wire bonders, ball bonders, and wedge bonders to TPT Japan. With excellent cost performance and a durable form, we respond flexibly to customization, making them more functional and versatile.