<Downloadable Material> [FIB-SEM] Method for Detecting Anomalies in Plating Layers
The FIB-SEM device allows for the observation of abnormal areas within the plating layer that are difficult to discern from the surface, and the Slice & View function enables the discovery of the origin of the abnormalities.
The FIB (Focused Ion Beam) device can automatically create continuous cross-sections and obtain cross-sectional images. Using this function, it is possible to identify abnormal areas within a sample that are difficult to discern from the surface. In this case, we will introduce the method of discovering abnormal areas within a plating layer that cannot be detected from the surface using the continuous automatic cross-section production function of the FIB device. For more details, please refer to the PDF document or feel free to contact us. *Additionally, our company specializes in wiring modifications for ICs and LSIs using FIB for circuit corrections. Specifically, we offer the following services on a short turnaround: - Cutting of wiring - Connecting wiring - Fabrication of test pads for characteristic evaluation We are here to assist with your IC and LSI development, so please do not hesitate to consult with us. *We also have other materials available. If you request them through the inquiry button, we will send them to you.
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■Method for Detecting Abnormalities in Plating Layers Using FIB ・Objective: To detect abnormalities within the plating layer that are not visible from the surface ・Method: Utilizing the continuous automatic cross-sectioning function of the FIB equipment
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For more details, please refer to the PDF document or feel free to contact us.
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Seiko Future Creation Co., Ltd. conducts business centered on contract analysis services, research and development, production technology, and FA systems, providing various services aimed at solving customer challenges. Regarding contract analysis, we have a proven track record of solving issues in the development, manufacturing, and quality assurance processes within the Seiko Group, allowing us to respond comprehensively by anticipating the background in various situations. We can handle samples ranging from million-order to nano-order sizes based on our extensive analytical experience primarily in watches and ICs, as well as in printer-related fields. In particular, we tackle customer challenges "from multiple perspectives and comprehensively" using the following technologies: - Microfabrication using a focused ion beam (FIB) device - Thermal analysis of material properties using differential scanning calorimetry (DSC) and others - Observation of microstructure using scanning probe microscopy (AFM) and others - Surface analysis using various devices (XPS, AES, GD-OES) - Cross-sectional observation and structural analysis using various devices (SEM, TEM) Our engineers are available for direct consultations. If you have any concerns, please feel free to reach out to us. *Seiko Future Creation Co., Ltd. changed its name from Seiko I-Techno Research Co., Ltd. on July 1, 2022.