The deformation and fracture of plastic washers, gaskets, etc., due to localized compressive stress can be estimated using a TMA and stress-strain measurement device.
●Sample: Estimation of deformation and fracture due to localized compressive stress on plastic washers, gaskets, etc. ●Method: Compression creep measurement and stress-strain measurement using TMA (Thermomechanical Analysis) and stress-strain measurement equipment. ●Results: The deformation of the sample due to compression was understood from the creep curve and stress-strain curve. Please take a moment to read the PDF materials. In addition to TMA, our company also specializes in various thermal analyses such as DSC and TG/DTA. ●DSC: Can be used for analysis of sample melting, glass transition, thermal history, crystallization, curing, Curie point, etc., as well as measuring specific heat. ●TG/DTA: Can be used for analysis of moisture content, ash content, decomposition, oxidation, and evaluation of heat resistance. ●TMA: Can be used for measuring sample expansion rate, glass transition, softening point, etc. We would be happy to discuss this case and thermal analysis with you at any time. https://www.seiko-sfc.co.jp/service/thermal.html Case introduction https://www.seiko-sfc.co.jp/case/index.html *Other materials are also available. Please request them through the inquiry button, and we will send them to you.
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Seiko Future Creation Co., Ltd. conducts business centered on contract analysis services, research and development, production technology, and FA systems, providing various services aimed at solving customer challenges. Regarding contract analysis, we have a proven track record of solving issues in the development, manufacturing, and quality assurance processes within the Seiko Group, allowing us to respond comprehensively by anticipating the background in various situations. We can handle samples ranging from million-order to nano-order sizes based on our extensive analytical experience primarily in watches and ICs, as well as in printer-related fields. In particular, we tackle customer challenges "from multiple perspectives and comprehensively" using the following technologies: - Microfabrication using a focused ion beam (FIB) device - Thermal analysis of material properties using differential scanning calorimetry (DSC) and others - Observation of microstructure using scanning probe microscopy (AFM) and others - Surface analysis using various devices (XPS, AES, GD-OES) - Cross-sectional observation and structural analysis using various devices (SEM, TEM) Our engineers are available for direct consultations. If you have any concerns, please feel free to reach out to us. *Seiko Future Creation Co., Ltd. changed its name from Seiko I-Techno Research Co., Ltd. on July 1, 2022.
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