High film thickness uniformity copper sulfate plating additive for via filling
Evolving stacked via technology to improve wiring flexibility! Newly developed additives for copper plating specialized in film thickness uniformity for fine circuit formation for high-speed transmission.
The COVID-19 pandemic has significantly changed our lifestyle, making remote work and online business the norm. The demand for information and communication devices in fields such as 5G smartphones, computers, data centers, and car electronics is further increasing, and there is a growing need for higher performance and higher density in the semiconductor package substrates used in these devices. Build-up methods are common for printed circuit boards used in smartphones and modules, and our electroplating additives for copper have a strong track record of adoption in this sector. Okuno Pharmaceutical Industry has evolved its stacked via technology to improve the wiring flexibility of circuits and has newly developed electroplating additives for copper that are specialized for uniform film thickness, intended for fine circuit formation used in high-speed transmission.
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basic information
In semiconductor package substrates, via holes with an insulation layer thickness of approximately 30μm are filled with an electroplated copper layer of about 15μm thickness. By using additives for via filling plating that excel in embedability, sufficient copper is filled into the via holes, resulting in a phenomenon known as overfilling, where the surface of the plated via holes takes on a dome shape. Insufficient filling of the via holes can lead to decreased reliability of interlayer connections, so package substrate manufacturers generally standardize dome-shaped via filling. However, if the outermost layer of plating exhibits an excessive dome shape, the connection reliability of mounted components decreases. Our "Topluchina HS5" has achieved high thickness uniformity and suppression of overfilling while maintaining excellent via filling performance through the optimization of the molecular structure of the suppressor, which improves polarization characteristics. This product is ideal for fine circuit formation for high-speed transmission and contributes to increased productivity and reliability in the production of electronic components and semiconductor packaging substrates.
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Semiconductor package substrate IC substrate
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Company information
Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.