Achieving probing compatible with multiple simultaneous measurements! Correcting misalignment after dicing.
We would like to introduce the "PCP-103SL/303N" handled by Plum Five Co., Ltd. Inspection of diced WLCSPs and packaged substrates (BGA, QFN, etc.) is realized through our unique probing method. By adopting our proprietary XY position correction function and profiling function, we have enabled probing that accommodates multiple simultaneous measurements by correcting the positional deviations caused by film tension after dicing and "distortion" or "deflection" from the dicer blade. 【Features】 ■ XY position correction probing ■ Multi-area alignment ■ Compatible with diced WLCSPs and packaged substrates (BGA, QFN, etc.) ■ Capable of inspection with chip reattachment to film frames ■ Employs a ring clamp method that is not affected by film sag *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Specifications】 ■Frame sizes: 2-6-1, 2-8-1, and 2-12 *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Examples of Achievements】 ■ 100% success rate in alignment with customer products (domestic achievements) ■ Cumulative delivery record of 500 units of the PCP series (as of April 2022) *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Plum Five Co., Ltd. is engaged in the design, manufacturing, sales, system software development, and maintenance of semiconductor inspection equipment in a consistent manner. As a semiconductor inspection equipment manufacturer, we will provide beneficial products and services to our customers involved in the semiconductor field. Through the development and provision of weather disaster prevention systems, we will offer systems that contribute to the safety and security of society.
