プラムファイブ Product Lineup

The "PCP-102WS" is a high-precision prober designed for contact on both sides of a wafer (double-sided). By adopting our unique XY position correction function and profiling function, effective position correction against wafer warpage is possible. By performing Kelvin connections on the drain side of the wafer's backside and aligning the drain sense position with the source sense position on the wafer's front side, accurate RDS (on) measurements can be achieved. 【Features】 ■ Probing of high current/high voltage is possible due to the wafer clamp method using ceramic blades. ■ Probing at multiple points within a single chip is possible. ■ A high-rigidity housing made of iron base and welded frame is adopted to achieve low vibration. ■ Low cost, high throughput. ■ Compact footprint and energy-saving design. *For more details, please refer to the PDF materials or feel free to contact us.

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• Semiconductor inspection/test equipment

We would like to introduce the "PCP-103SL/303N" handled by Plum Five Co., Ltd. Inspection of diced WLCSPs and packaged substrates (BGA, QFN, etc.) is realized through our unique probing method. By adopting our proprietary XY position correction function and profiling function, we have enabled probing that accommodates multiple simultaneous measurements by correcting the positional deviations caused by film tension after dicing and "distortion" or "deflection" from the dicer blade. 【Features】 ■ XY position correction probing ■ Multi-area alignment ■ Compatible with diced WLCSPs and packaged substrates (BGA, QFN, etc.) ■ Capable of inspection with chip reattachment to film frames ■ Employs a ring clamp method that is not affected by film sag *For more details, please refer to the PDF document or feel free to contact us.

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• Semiconductor inspection/test equipment

The PCP-102SL is a prober developed to enable the inspection of thin wafers in addition to standard wafers. It performs automatic transport from the cassette, pre-alignment, fine alignment, and probing (inspection). 【Features】 - Eliminates cumulative errors in contact due to stage indexing, initial settings, temperature, and more. - Multi-probing inspection significantly improves the throughput of the inspection process. *For more details, please request materials or view the PDF data available for download.

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