Remove photoresist and organic polymer residues at low temperatures! Introducing our plasma removal equipment.
We would like to introduce "HDRF," which is handled by Plasma Therm Japan Co., Ltd. It removes photoresist and organic polymer residues at low temperatures, which is particularly important during the device manufacturing stages of MEMS, LEDs, and advanced packaging. Please feel free to contact us if you have any inquiries. 【Features】 ■ Temperature - Low temp: 50℃ to 150℃ - High rate: 150℃ to 250℃ ■ Wafer: 2" to 8" * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.
Inquire About This Product
basic information
*You can download the English version of the catalog. *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
*You can download the English version of the catalog. *For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
News about this product（1）
Company information
Our company offers etching, film deposition, and cutting equipment utilizing plasma technology, as well as the sale of ICP, RIE, DSE, IBE, IBD, PECVD, HDPCVD, and HDRF F.A.S.T.-ALD equipment, along with customer service related to these devices. Plasma-Therm LLC, headquartered in Florida, USA, was established in 1974. Since its founding, it has been manufacturing and selling semiconductor manufacturing equipment utilizing plasma technology for over 50 years. Please feel free to contact us for inquiries. ▼ Group company Corial official website https://corial.plasmatherm.com/en
![[Patent] Achieving an air nozzle that completely removes water with air blow.](https://image.mono.ipros.com/public/product/image/2116982/IPROS16998950562973190030.png?w=280&h=280)