Use the entire surface of the grinding disc uniformly! Work can be done using two grinding methods: "free lap method" and "guide ring method."
The "Koro-style Forced Drive Oscillation Holding Unit" is a product that can be installed on e-type polishing devices (MA-200e, MA-300e, MA-400e). By forcibly rotating the sample holder, it is possible to quantitatively manage the polishing process. Additionally, by oscillating the sample holder, the entire surface of the polishing disk is used uniformly, maintaining flatness and improving the flatness of the sample processing surface itself. 【Features】 ■ Can be installed on e-type polishing devices (MA-200e, MA-300e, MA-400e) ■ Enables quantitative management of the polishing process ■ Improves the flatness of the sample processing surface itself ■ Two types of polishing methods ・ "Free Lap Method" following the flatness of the polishing disk ・ "Guide Ring Method" with high parallel accuracy * For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Specifications of SD-200】 ■Compatible polishing device: MA-200e ■Maximum sample holder outer diameter: Φ108mm ■Maximum swing angle: 13° ■Motor movable parts: Drive wheel part for forced rotation of sample holder, arm swing part ■Adjustable items: Rotation speed of drive wheel part for forced rotation of sample holder, swing width of arm swing part 【Specifications of SD-400】 ■Compatible polishing devices: MA-300e/ MA-400e ■Maximum sample holder outer diameter: Φ165.2mm ■Maximum swing angle: 14.2° ■Motor movable parts: Drive wheel part for forced rotation of sample holder, arm swing part ■Adjustable items: Rotation speed of drive wheel part for forced rotation of sample holder, swing width of arm swing part *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
■Examples of materials with processing achievements Semiconductor materials (silicon, germanium, silicon carbide, strontium silicate, gallium arsenide, indium gallium arsenide, indium phosphide, indium gallium zinc oxide, gallium nitride, gallium oxide, cadmium telluride, etc.) Optical materials (quartz glass, sapphire, fluorite lenses, spinel, phosphate glass, lithium borate, acrylic resin, CLBO, YiG, GGG, etc.) Ceramic materials (alumina, zirconia, silicon nitride, ferrite, etc.) Metal materials (steel materials, stainless steel, copper, gold, silver, platinum, aluminum, titanium, molybdenum, etc.) *For more details, please refer to the PDF materials or feel free to contact us.*
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Our company has been manufacturing polishing equipment, cutting machines, and scribers suitable for precision machining using the technical know-how we have cultivated over many years. We have a significant track record, particularly in cutting-edge technology fields such as semiconductors, ceramics, and optical communications. In addition to standard specification equipment, we also accept the design and manufacture of custom specifications tailored to our customers' needs. To meet the increasing demands for precision in machining and the diversifying needs, we will continue to advance with innovative ideas and technology.
