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  6. Warping of the circuit board that occurs during BGA rework.

Warping of the circuit board that occurs during BGA rework.

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last updated:Jun 24, 2025

ケイ・オール
ケイ・オール
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Especially for substrates that warp significantly, warping suppression is essential! Reproduce the condition of the BGA when warping occurs!

When we talk about "high-difficulty BGA rework," what kind of content do you imagine? Underfill, high-layer-count PCBs, jumpers from all BGA pins, and so on—these are things that are visually recognizable as "difficult." However, there are also aspects that are not easily understood just by appearance. One of these is "BGA rework on PCBs that are prone to warping (distortion)." Our company employs various methods to suppress warping, but there are some PCBs that are not easily managed, leading to ongoing struggles. This time, we have recreated the condition of a BGA when warping occurs. You can view the detailed content through the related links, so please take a look. *For more details, please refer to the PDF materials or feel free to contact us.

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Warping of the circuit board that occurs during BGA rework.

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  • Related Link - https://www.kei-all.co.jp/company/blog/post-1367/
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Technical Document "Underfill BGA Rework Technology"

Technical Document "Underfill BGA Rework Technology"

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Company Profile

Company Profile

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Excerpt of Prototype Parts Implementation Know-How

Excerpt of Prototype Parts Implementation Know-How

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ケイ・オール

ケイ・オール

Manufacturing and processing contract

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Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.

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